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ISD17150XY

更新时间： 2024-01-02 14:08:14

品牌	Logo	应用领域
华邦 - WINBOND		/
页数	文件大小	规格书
24页	351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

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技术参数
数据手册

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ISD17150XY 技术参数

生命周期：	Transferred	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.7
Is Samacsys：	N	Base Number Matches：	1

ISD17150XY 数据手册

ISD1700 SERIES

Example #3: Connecting the SPI Interface to a microcontroller

Reset

REC

RESET

PLAY

ERASE

0.1μF

vAlert

1 KΩ

LED

FWD

Vcc

Gnd

V_CCD

V_CCA

V_CCD

V_CCP

VOL

V_CCD

V_SSD

0.1

V_CCA

V_SSA

0.1

V_CCP

SCLK

MOSI

MISO

V_CCP

To uC

SPI

ISD1700

V_SSP1

0.1

V_SSP2

Speaker

or Buzzer

V_CC

SP+

SP-

MIC+

MIC -

Speaker

AUD

AUX

0.1μF

AUD/AUX

INT/RDY

8050C

AnaIn

V_CCD

100 KΩ

Optional

Rosc ***

390

R_OSC

AGC

0.1μ F

4.7

Optional: based upon the applications

*** At 8kHz sampling freq, Rosc = 80 K

: Digital ground;

: Analog ground;

: Ground for SP+;

: Ground for SP-

10.1

GOOD AUDIO DESIGN PRACTICES

To ensure the highest quality of voice reproduction, it is important to follow good audio design

practices in layout and power supply decoupling. See recommendations from below links or other

Application Notes in our websites.

Design Considerations for ISD1700 Family

AN-CC1002 Design Considerations for ISD1700 Family.pdf

Good Audio Design Practices

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf

Single-Chip Board Layout Diagrams

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf

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与ISD17150XY相关器件

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ISD17150XY01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17150XYI	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17150XYI01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17150XYIR	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17150XYIR01	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格
ISD17150XYR	WINBOND	Multi-Message Single-Chip Voice Record & Playback Devices	获取价格