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ISD17150XY PDF预览

ISD17150XY

更新时间: 2024-01-20 18:31:45
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
24页 351K
描述
Multi-Message Single-Chip Voice Record & Playback Devices

ISD17150XY 技术参数

生命周期:Transferred包装说明:,
Reach Compliance Code:unknown风险等级:5.7
Is Samacsys:NBase Number Matches:1

ISD17150XY 数据手册

 浏览型号ISD17150XY的Datasheet PDF文件第16页浏览型号ISD17150XY的Datasheet PDF文件第17页浏览型号ISD17150XY的Datasheet PDF文件第18页浏览型号ISD17150XY的Datasheet PDF文件第20页浏览型号ISD17150XY的Datasheet PDF文件第21页浏览型号ISD17150XY的Datasheet PDF文件第22页 
ISD1700 SERIES  
11 PACKAGING  
11.1 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 - IQC  
HD  
D
c
e
E
b
θ
A
A
1
L
Y
2
A
L
1
Dimension in Inches Dimension in mm  
Symbol  
Max.  
1.20  
Min. Nom. Max. Min. Nom.  
0.047  
A
0.006  
0.041  
0.05  
0.002  
0.035  
0.15  
1
A
0.95  
0.17  
0.040  
1.00  
0.20  
2
A
1.05  
0.27  
0.007 0.008 0.011  
b
c
D
E
0.10  
0.004  
0.461  
0.008  
0.465 0.469  
0.15  
11.80  
8.00  
0.21  
0.006  
11.70  
11.90  
0.311 0.315 0.319  
0.520 0.528 0.536  
7.90  
8.10  
13.60  
13.40  
13.20  
D
H
0.022  
0.020 0.024 0.028  
0.031  
0.55  
0.60  
0.80  
e
L
L
0.50  
0.70  
1
0.000  
0
0.10  
5
0.004  
5
0.00  
0
Y
3
3
θ
Publication Release Date: January 23, 2007  
Revision 1.3-S2  
- 19 -  

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