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IS61LV6432-166TQ PDF预览

IS61LV6432-166TQ

更新时间: 2024-02-12 09:03:20
品牌 Logo 应用领域
美国芯成 - ISSI 时钟静态存储器内存集成电路
页数 文件大小 规格书
16页 174K
描述
Cache SRAM, 64KX32, 5ns, CMOS, PQFP100, TQFP-100

IS61LV6432-166TQ 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP, QFP100,.63X.87
针数:100Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92最长访问时间:5 ns
其他特性:SELF-TIMED WRITE; BYTE WRITE CONTROL; POWER-DOWN OPTION最大时钟频率 (fCLK):166 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:2097152 bit内存集成电路类型:CACHE SRAM
内存宽度:32功能数量:1
端子数量:100字数:65536 words
字数代码:64000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:64KX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
电源:2.5/3.3,3.3 V认证状态:Not Qualified
座面最大高度:1.6 mm最大待机电流:0.005 A
最小待机电流:3 V子类别:SRAMs
最大压摆率:0.215 mA最大供电电压 (Vsup):3.63 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD宽度:14 mm
Base Number Matches:1

IS61LV6432-166TQ 数据手册

 浏览型号IS61LV6432-166TQ的Datasheet PDF文件第2页浏览型号IS61LV6432-166TQ的Datasheet PDF文件第3页浏览型号IS61LV6432-166TQ的Datasheet PDF文件第4页浏览型号IS61LV6432-166TQ的Datasheet PDF文件第5页浏览型号IS61LV6432-166TQ的Datasheet PDF文件第6页浏览型号IS61LV6432-166TQ的Datasheet PDF文件第7页 
®
IS61LV6432  
64K x 32 SYNCHRONOUS  
PIPELINE STATIC RAM  
ISSI  
MAY 1998  
FEATURES  
DESCRIPTION  
The ISSI IS61LV6432 is a high-speed, low-power synchro-  
nous static RAM designed to provide a burstable, high-  
performance, secondary cache for the Pentium™, 680X0™,  
and PowerPC™ microprocessors. It is organized as 65,536  
words by 32 bits, fabricated with ISSI's advanced CMOS  
technology. The device integrates a 2-bit burst counter, high-  
speed SRAM core, and high-drive capability outputs into a  
single monolithic circuit. All synchronous inputs pass through  
registers controlled by a positive-edge-triggered single clock  
input.  
• Internal self-timed write cycle  
• Individual Byte Write Control and Global Write  
• Clock controlled, registered address, data and  
control  
• Pentium™ or linear burst sequence control  
using MODE input  
• Three chip enables for simple depth expansion  
and address pipelining  
• Common data inputs and data outputs  
• Power-down control by ZZ input  
Write cycles are internally self-timed and are initiated by the  
rising edge of the clock input. Write cycles can be from one to  
four bytes wide as controlled by the write control inputs.  
• JEDEC 100-Pin TQFP and PQFP package  
• 3.3V VCC and 2.5V VCCQ for 2.5 I/O's  
Separate byte enables allow individual bytes to be written.  
BW1 controls DQ1-DQ8, BW2 controls DQ9-DQ16, BW3  
controlsDQ17-DQ24,BW4controlsDQ25-DQ32,conditioned  
byBWEbeingLOW.ALOWonGWinputwouldcauseallbytes  
to be written.  
• Two Clock enables and one Clock disable to  
eliminate multiple bank bus contention.  
• Control pins mode upon power-up:  
– MODE in interleave burst mode  
– ZZ in normal operation mode  
These control pins can be connected to GNDQ  
or VCCQ to alter their power-up state  
Bursts can be initiated with either ADSP (Address Status  
Processor) or ADSC (Address Status Cache Controller) input  
pins. Subsequent burst addresses can be generated inter-  
nally by the IS61LV6432 and controlled by the ADV (burst  
address advance) input pin.  
• Industrial temperature available  
Asynchronoussignalsincludeoutputenable(OE),sleepmode  
input(ZZ), clock(CLK)andburstmodeinput(MODE). AHIGH  
input on the ZZ pin puts the SRAM in the power-down state.  
When ZZ is pulled LOW (or no connect), the SRAM normally  
operates after three cycles of the wake-up period. A LOW  
input, i.e., GNDQ, on MODE pin selects LINEAR Burst. AVCCQ  
(or no connect) on MODE pin selects INTERLEAVED Burst.  
FAST ACCESS TIME  
Symbol  
tKQ  
Parameter  
-166  
5
-133  
5
-117  
5
-5  
5
-6  
6
-7  
7
-8  
8
Unit  
ns  
CLK Access Time  
Cycle Time  
tKC  
6
7.5  
133  
8.5  
117  
10  
100  
12  
83  
13  
75  
15  
66  
ns  
Frequency  
166  
MHz  
This document contains PRELIMINARY data. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product.  
We assume no responsibility for any errors which may appear in this publication. © Copyright 1997, Integrated Silicon Solution, Inc.  
Integrated Silicon Solution, Inc.  
PRELIMINARY SR018-1C  
1
06/01/98  

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