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IRFZ24VLPBF PDF预览

IRFZ24VLPBF

更新时间: 2024-01-12 08:41:40
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
10页 267K
描述
HEXFET Power MOSFET

IRFZ24VLPBF 数据手册

 浏览型号IRFZ24VLPBF的Datasheet PDF文件第2页浏览型号IRFZ24VLPBF的Datasheet PDF文件第3页浏览型号IRFZ24VLPBF的Datasheet PDF文件第4页浏览型号IRFZ24VLPBF的Datasheet PDF文件第5页浏览型号IRFZ24VLPBF的Datasheet PDF文件第6页浏览型号IRFZ24VLPBF的Datasheet PDF文件第7页 
PD - 95524  
IRFZ24VSPbF  
IRFZ24VLPbF  
HEXFET® Power MOSFET  
l Advanced Process Technology  
l Ultra Low On-Resistance  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
l Optimized for SMPS Applications  
l Lead-Free  
D
VDSS = 60V  
RDS(on) = 60mΩ  
G
ID = 17A  
S
Description  
Advanced HEXFET® Power MOSFETs from International Rectifier utilize  
advanced processing techniques to achieve extremely low on-resistance  
per silicon area. This benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET power MOSFETs are well known  
for, provides the designer with an extremely efficient and reliable device for  
use in a wide variety of applications.  
The D2Pak is a surface mount power package capable of accommodating  
die sizes up to HEX-4. It provides the highest power capability and the  
lowest possible on-resistance in any existing surface mount package. The  
D2Pak is suitable for high current applications because of its low internal  
connection resistance and can dissipate up to 2.0W in a typical surface  
mount application.  
D2Pak  
IRFZ24VS  
TO-262  
IRFZ24VL  
Thethrough-holeversion(IRFZ24VL)isavailableforlow-profileapplications.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V‡  
Continuous Drain Current, VGS @ 10V‡  
Pulsed Drain Current ‡  
17  
12  
A
68  
PD @TC = 25°C  
Power Dissipation  
44  
0.29  
W
W/°C  
V
Linear Derating Factor  
VGS  
IAR  
Gate-to-Source Voltage  
± 20  
Avalanche Current  
17  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ‡  
Operating Junction and  
4.4  
mJ  
V/ns  
4.2  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient (PCB Mounted)**  
Typ.  
–––  
–––  
Max.  
3.4  
40  
Units  
RθJC  
RθJA  
°C/W  
www.irf.com  
1
7/16/04  

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