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IRFR9014TRR PDF预览

IRFR9014TRR

更新时间: 2024-10-03 01:10:11
品牌 Logo 应用领域
科盛美 - KERSEMI /
页数 文件大小 规格书
7页 4533K
描述
Power MOSFET

IRFR9014TRR 数据手册

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IRFR9014, IRFU9014, SiHFR9014, SiHFU9014  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
- 60  
Available  
• Repetitive Avalanche Rated  
RDS(on) (Ω)  
VGS = - 10 V  
0.50  
RoHS*  
• Surface Mount (IRFR9014/SiHFR9014)  
COMPLIANT  
Qg (Max.) (nC)  
12  
• Straight Lead (IRFU9014/SiHFU9014)  
Q
gs (nC)  
3.8  
• Available in Tape and Reel  
Qgd (nC)  
5.1  
• P-Channel  
Configuration  
Single  
• Fast Switching  
S
• Lead (Pb)-free Available  
DESCRIPTION  
DPAK  
IPAK  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
(TO-252)  
(TO-251)  
G
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
D
P-Channel MOSFET  
are possible in typical surface mount applications.  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
DPAK (TO-252)  
IRFR9014TRLPbFa  
SiHFR9014TL-E3a  
IRFR9014TRLa  
SiHFR9014TLa  
DPAK (TO-252)  
IRFR9014TRPbFa  
SiHFR9014T-E3a  
IRFR9014TRa  
IPAK (TO-251)  
IRFU9014PbF  
SiHFU9014-E3  
IRFU9014  
IRFR9014PbF  
SiHFR9014-E3  
IRFR9014  
Lead (Pb)-free  
SnPb  
SiHFR9014  
SiHFR9014Ta  
SiHFU9014  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 60  
20  
V
VGS  
T
C = 25 °C  
- 5.1  
- 3.2  
- 20  
Continuous Drain Current  
VGS at 5.0 V  
ID  
TC =100°C  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
0.20  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
0.020  
140  
EAS  
IAR  
mJ  
A
- 5.1  
2.5  
EAR  
mJ  
TC = 25 °C  
25  
PD  
W
TA = 25 °C  
2.5  
dV/dt  
- 4.5  
- 55 to + 150  
V/ns  
Operating Junction and Storage Temperature Range  
TJ, Tstg  
°C  
Soldering Recommendations (Peak Temperature)  
for 10 s  
260d  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = - 25 V, starting TJ = 25 °C, L = 6.3 mH, RG = 25 Ω, IAS = - 5.1 A (see fig. 12).  
c. ISD - 6.7 A, dI/dt 90 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
www.kersemi.com  
1

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