IR2101/IR21014/IR2102/IR21024
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured
under board mounted and still air conditions.
Symbol
Definition
Min.
Max.
Units
V
High side floating supply voltage
-0.3
625
B
S
V
High side floating supply offset voltage
High side floating output voltage
Low side and logic fixed supply voltage
Low side output voltage
V
- 25
V
+ 0.3
+ 0.3
25
B
B
V
HO
V
- 0.3
V
B
S
V
V
CC
-0.3
V
-0.3
-0.3
—
V
+ 0.3
+ 0.3
LO
CC
V
IN
Logic input voltage (HIN & LIN)
Allowable offset supply voltage transient
V
CC
dV /dt
S
50
V/ns
W
P
Package power dissipation @ T ≤ +25°C
(8 lead PDIP)
(8 lead SOIC)
(14 lead PDIP)
(14 lead SOIC)
(8 lead PDIP)
(8 lead SOIC)
(14 lead PDIP)
(14 lead SOIC)
—
1.0
0.625
1.6
D
A
—
—
—
1.0
Rth
Thermal resistance, junction to ambient
—
125
200
75
JA
—
°C/W
°C
—
—
120
150
150
300
T
T
Junction temperature
—
J
Storage temperature
-55
—
S
T
Lead temperature (soldering, 10 seconds)
L
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The V offset rating is tested with all supplies biased at 15V differential.
S
Symbol
Definition
High side floating supply absolute voltage
High side floating supply offset voltage
High side floating output voltage
Min.
Max.
Units
V
V
V
S
+ 10
V + 20
S
B
S
Note 1
600
V
HO
V
V
B
S
V
V
Low side and logic fixed supply voltage
Low side output voltage
10
0
20
CC
V
V
CC
LO
V
Logic input voltage (HIN & LIN) (IR2101) & (HIN & LIN) (IR2102)
Ambient temperature
0
V
IN
CC
T
-40
125
°C
A
Note 1: Logic operational for V of -5 to +600V. Logic state held for V of -5V to -V .
BS
S
S
2