Datasheet > INA821IDRGT

INA821IDRGT

更新时间： 2023-09-03 20:30:33

品牌	Logo	应用领域
德州仪器 - TI		放大器仪表仪表放大器
页数	文件大小	规格书
49页	1849K
描述
高带宽 (4.7MHz)、低噪声 (7nV/√Hz)、精密 (35μV)、低功耗仪表放大器 \| DRG \| 8 \| -40 to 125

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INA821IDRGT 数据手册

INA821

www.ti.com.cn

ZHCSIM8C –AUGUST 2018–REVISED JULY 2019

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–20

MAX

UNIT

Supply voltage

Voltage

–40

Signal input pins

REF pin

–20

Signal output pins

(-V_s) - 0.5

(+V_s) + 0.5

Output short-circuit⁽²⁾

Continuous

Operating Temperature, T_A

Junction Temperature, T_J

Storage Temperature, T_stg

–50

150

175

150

°C

–65

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Short-circuit to V_S/ 2.

7.2 ESD Ratings

VALUE

±1500

±750

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾

V_(ESD)

Electrostatic discharge

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

4.5

MAX

UNIT

Single-supply

Supply voltage V_S

Dual-supply

±2.25

–40

±18

125

Specified temperature

°C

7.4 Thermal Information

INA821

DGK (VSSOP)

THERMAL METRIC⁽¹⁾

D (SOIC)

UNIT

8 PINS

119.6

66.3

8 PINS

215.4

66.3

R_θJA

Junction-to-ambient thermal resistance

°C/W

R_θJC(top)

R_θJB

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

61.9

97.8

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

20.5

10.5

ψ_JB

61.4

96.1

R_θJC(bot)

N/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

1 2 3 456 7 8...49

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