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IDT72V261LA10TFI PDF预览

IDT72V261LA10TFI

更新时间: 2024-02-09 22:43:14
品牌 Logo 应用领域
艾迪悌 - IDT 先进先出芯片
页数 文件大小 规格书
27页 302K
描述
3.3 VOLT CMOS SuperSync FIFO

IDT72V261LA10TFI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFP
包装说明:LFQFP, QFP64,.47SQ,20针数:64
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.71风险等级:5.22
最长访问时间:6.5 ns其他特性:RETRANSMIT
最大时钟频率 (fCLK):100 MHz周期时间:10 ns
JESD-30 代码:S-PQFP-G64JESD-609代码:e3
长度:10 mm内存密度:147456 bit
内存集成电路类型:OTHER FIFO内存宽度:9
湿度敏感等级:3功能数量:1
端子数量:64字数:16384 words
字数代码:16000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:16KX9可输出:YES
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装等效代码:QFP64,.47SQ,20封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
最大待机电流:0.02 A子类别:FIFOs
最大压摆率:0.055 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:10 mmBase Number Matches:1

IDT72V261LA10TFI 数据手册

 浏览型号IDT72V261LA10TFI的Datasheet PDF文件第1页浏览型号IDT72V261LA10TFI的Datasheet PDF文件第2页浏览型号IDT72V261LA10TFI的Datasheet PDF文件第4页浏览型号IDT72V261LA10TFI的Datasheet PDF文件第5页浏览型号IDT72V261LA10TFI的Datasheet PDF文件第6页浏览型号IDT72V261LA10TFI的Datasheet PDF文件第7页 
IDT72V261LA/72V271LA  
3.3 VOLT CMOS SuperSync FIFO™ 16,384 x 9 and 32,768 x 9  
COMMERCIAL AND INDUSTRIAL  
TEMPERATURE RANGES  
For serial programming, SEN together with LD on each rising edge of  
WCLK, are used to load the offset registers via the Serial Input (SI). For  
parallel programming, WEN together with LD on each rising edge of WCLK,  
are used to load the offset registers via Dn. REN together with LD on each  
rising edge of RCLK can be used to read the offsets in parallel from Qn  
regardless of whether serial or parallel offset loading has been selected.  
During Master Reset (MRS) the following events occur: The read and  
write pointers are set to the first location of the FIFO. The FWFT pin  
selects IDT Standard mode or FWFT mode. The LD pin selects either a  
partial flag default setting of 127 with parallel programming or a partial flag  
default setting of 1,023 with serial programming. The flags are updated  
according to the timing mode and default offsets selected.  
The Partial Reset (PRS) also sets the read and write pointers to the first  
location of the memory. However, the timing mode, partial flag program-  
ming method, and default or programmed offset settings existing before  
Partial Reset remain unchanged. The flags are updated according to the  
timing mode and offsets in effect. PRS is useful for resetting a device in  
mid-operation, when reprogramming partial flags would be undesirable.  
The Retransmit function allows data to be reread from the FIFO more  
than once. A LOW on the RT input during a rising RCLK edge initiates a  
retransmit operation by setting the read pointer to the first location of the  
memory array.  
DESCRIPTION (CONTINUED)  
There are two possible timing modes of operation with these devices:  
IDT Standard mode and First Word Fall Through (FWFT) mode.  
In IDT Standard mode, the first word written to an empty FIFO will not  
appear on the data output lines unless a specific read operation is  
performed. A read operation, which consists of activating REN and  
enabling a rising RCLK edge, will shift the word from internal memory to  
the data output lines.  
In FWFT mode, the first word written to an empty FIFO is clocked  
directly to the data output lines after three transitions of the RCLK signal. A  
REN does not have to be asserted for accessing the first word. However,  
subsequent words written to the FIFO do require a LOW on REN for  
access. The state of the FWFT/SI input during Master Reset determines  
the timing mode in use.  
For applications requiring more data storage capacity than a single  
FIFO can provide, the FWFT timing mode permits depth expansion by  
chaining FIFOs in series (i.e. the data outputs of one FIFO are connected  
to the corresponding data inputs of the next). No external logic is re-  
quired.  
These FIFOs have five flag pins, EF/OR (Empty Flag or Output Ready),  
FF/IR (Full Flag or Input Ready), HF (Half-full Flag), PAE (Programmable  
Almost-Empty flag) and PAF (Programmable Almost-Full flag). The EF  
and FF functions are selected in IDT Standard mode. The IR and OR  
functions are selected in FWFT mode. HF, PAE and PAF are always  
available for use, irrespective of timing mode.  
If, at any time, the FIFO is not actively performing an operation, the chip  
will automatically power down. Once in the power down state, the standby  
supply current consumption is minimized. Initiating any operation (by acti-  
vating control inputs) will immediately take the device out of the power  
down state.  
PAE and PAF can be programmed independently to switch at any point  
in memory. (See Table 1 and Table 2.) Programmable offsets determine  
the flag switching threshold and can be loaded by two methods: parallel or  
serial. Two default offset settings are also provided, so that PAE can be  
set to switch at 127 or 1,023 locations from the empty boundary and the  
PAF threshold can be set at 127 or 1,023 locations from the full boundary.  
These choices are made with the LD pin during Master Reset.  
The IDT72V261LA/72V271LA are fabricated using IDTs high speed  
submicron CMOS technology.  
PARTIAL RESET (PRS) MASTER RESET (MRS)  
READ CLOCK (RCLK)  
READ ENABLE (REN)  
OUTPUT ENABLE (OE)  
WRITE CLOCK (WCLK)  
WRITE ENABLE (WEN)  
LOAD (LD)  
DATA OUT (Q0 - Qn)  
DATA IN (D0 - Dn)  
IDT  
72V261LA  
72V271LA  
RETRANSMIT (RT)  
SERIAL ENABLE(SEN)  
FIRST WORD FALL THROUGH/SERIAL INPUT  
(FWFT/SI)  
EMPTY FLAG/OUTPUT READY (EF/OR)  
PROGRAMMABLE ALMOST-EMPTY (PAE)  
FULL FLAG/INPUT READY (FF/IR)  
HALF FULL FLAG (HF)  
PROGRAMMABLE ALMOST-FULL (PAF)  
4673 drw 03  
Figure 1. Block Diagram of Single 16,384 x 9 and 32,768 x 9 Synchronous FIFO  
3

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