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IDT71V25761S200PFG8 PDF预览

IDT71V25761S200PFG8

更新时间: 2024-01-02 17:10:43
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器内存集成电路
页数 文件大小 规格书
21页 322K
描述
Cache SRAM, 128KX36, 3.1ns, CMOS, PQFP100, 14 X 20 MM, GREEN, PLASTIC, TQFP-100

IDT71V25761S200PFG8 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFP
包装说明:LQFP,针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.52
最长访问时间:3.1 ns其他特性:PIPELINED ARCHITECTURE
JESD-30 代码:R-PQFP-G100JESD-609代码:e3
长度:20 mm内存密度:4718592 bit
内存集成电路类型:CACHE SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:100字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:128KX36封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:1.6 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:14 mmBase Number Matches:1

IDT71V25761S200PFG8 数据手册

 浏览型号IDT71V25761S200PFG8的Datasheet PDF文件第2页浏览型号IDT71V25761S200PFG8的Datasheet PDF文件第3页浏览型号IDT71V25761S200PFG8的Datasheet PDF文件第4页浏览型号IDT71V25761S200PFG8的Datasheet PDF文件第5页浏览型号IDT71V25761S200PFG8的Datasheet PDF文件第6页浏览型号IDT71V25761S200PFG8的Datasheet PDF文件第7页 
128K X 36  
IDT71V25761YS/S  
3.3VSynchronousSRAMs  
2.5V I/O, Pipelined Outputs,  
Burst Counter, Single Cycle Deselect  
Features  
Description  
128K x 36 memory configuration  
TheIDT71V25761arehigh-speedSRAMsorganizedas128Kx36.  
The IDT71V25761 SRAMs contain write, data, address and control  
registers. InternallogicallowstheSRAMtogenerateaself-timedwrite  
basedupona decisionwhichcanbe leftuntilthe endofthe write cycle.  
Theburstmodefeatureoffersthehighestlevelofperformancetothe  
systemdesigner,astheIDT71V25761canprovidefourcyclesofdatafor  
a single address presented to the SRAM. An internal burst address  
counteracceptsthefirstcycleaddressfromtheprocessor,initiatingthe  
Supports high system speed:  
Commercial:  
– 200MHz 3.1ns clock access time  
CommercialandIndustrial:  
– 183MHz 3.3ns clock access time  
– 166MHz 3.5ns clock access time  
LBO input selects interleaved or linear burst mode  
Self-timedwritecyclewithglobalwritecontrol(GW),bytewrite accesssequence.Thefirstcycleofoutputdatawillbepipelinedforone  
enable (BWE), and byte writes (BWx)  
3.3V core power supply  
Power down controlled by ZZ input  
2.5V I/O  
Optional - Boundary Scan JTAG Interface (IEEE 1149.1  
Compliant)  
Packaged in a JEDEC Standard 100-pin plastic thin quad CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
flatpack(TQFP),119ballgridarray(BGA)and165finepitchball 100-pinthinplasticquadflatpack(TQFP)aswellasa119 ballgridarray  
cycle before it is available on the next rising clock edge. If burst mode  
operationisselected(ADV=LOW),thesubsequentthreecyclesofoutput  
datawillbeavailabletotheuseronthenextthreerisingclockedges. The  
orderofthesethreeaddressesaredefinedbytheinternalburstcounter  
andthe LBO inputpin.  
The IDT71V25761 SRAMs utilize IDT’s latest high-performance  
grid array  
(BGA) and 165 fine pitch ball grid array (fBGA).  
PinDescriptionSummary  
A0-A17  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Output  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enable  
CE  
CS  
0
, CS  
1
Chip Selects  
Output Enable  
OE  
GW  
Global Write Enable  
Byte Write Enable  
Individual Byte Write Selects  
Clock  
BWE  
BW , BW  
(1)  
1
2
, BW  
3
, BW  
4
CLK  
Burst Address Advance  
Address Status (Cache Controller)  
Address Status (Processor)  
Linear / Interleaved Burst Order  
Test Mode Select  
Test Data Input  
Synchronous  
Synchronous  
Synchronous  
DC  
ADV  
ADSC  
ADSP  
LBO  
TMS  
TDI  
Synchronous  
Synchronous  
N/A  
TCK  
TDO  
TRST  
ZZ  
Test Clock  
Test Data Output  
Synchronous  
Asynchronous  
Asynchronous  
Synchronous  
N/A  
JTAG Reset (Optional)  
Sleep Mode  
I/O  
0
-I/O31, I/OP1-I/OP4  
DD, VDDQ  
SS  
Data Input / Output  
Core Power, I/O Power  
Ground  
V
Supply  
Supply  
V
N/A  
5297 tbl 01  
MAY 2010  
1
©2010IntegratedDeviceTechnology,Inc.  
DSC-5297/05  

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