Datasheet > IC51-0502-1708

IC51-0502-1708

更新时间： 2024-01-27 06:51:24

品牌	Logo	应用领域
其他 - ETC		PC
页数	文件大小	规格书
7页	444K
描述
SOP (Small Outline Packages, Gullwing Leads)

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中文翻译

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技术参数
数据手册

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IC51-0502-1708 技术参数

生命周期：	Contact Manufacturer	Reach Compliance Code：	unknown
ECCN代码：	EAR99	HTS代码：	8536.69.40.40
风险等级：	5.65	其他特性：	WITH SEPARATOR
主体宽度：	0.402 inch	联系完成配合：	AU ON NI
触点材料：	BE-CU	触点样式：	BELLOWED TYPE
设备插槽类型：	IC SOCKET	使用的设备类型：	TSOP50
介电耐压：	700VAC V	外壳材料：	POLYETHERSULFONE
绝缘电阻：	1000000000 Ω	插接触点节距：	0.031 inch
安装方式：	STRAIGHT	触点数：	50
最高工作温度：	150 °C	最低工作温度：	-40 °C
PCB触点行间距：	0.1/0.492 mm	端子节距：	1.5748 mm
端接类型：	SOLDER	Base Number Matches：	1

IC51-0502-1708 数据手册

Series Overview

*SOP (Small Outline Packages, Gullwing Leads)

SMT Devices

*SOP variations e.g. TSSOP...

Series IC51 (Clamshell)

SOP, TSOP Type I & II

0.4 to 1.27mm Pitch

Part Number (Details)

Speciﬁcations

Insulation Resistance:

1,000MΩ min. at 500V DC

Dielectric Withstanding Voltage: 700V AC for 1 minute

IC51

Series No.

- 028 2 - 334-1 - MF

Contact Resistance:

30mΩ max. at 10mA/20mV max.

Operating Temperature Range:

–40°C to +150°C (for type PSF)

–55°C to +170°C (for type PES & PEI)

10,000 insertions min.

No. of Contact Pins

Mating Cycles:

No. of Sides with Contacts

Design Number

Materials and Finish

Housing: Polyetherimide (PEI), glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

Plating: Gold over Nickel

MF= Flanged

Unmarked = Not Flanged

Series IC189 (Open Top)

SOP, TSOP Type I & II

0.4 to 1.27mm Pitch

Speciﬁcations

Part Number (Details)

Insulation Resistance:

1,000MΩ min. at 100V DC, pitch 0.4, 0.5

1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27

IC189

016

019 *

Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, 0.5

Series No.

500V AC for 1 minute, pitch 0.65

700V AC for 1 minute, pitch 0.8, 1.27

30mΩ max. at 10mA/20mV max.

No. of Contact Pins

Contact Resistance:

Operating Temperature Range: –40°C to +150°C

Number of Sides

with Contacts

Mating Cycles:

Contact Force:

10,000 insertions

20g to 80g per pin

Design Number

Materials and Finish

Positioning Pin:

Housing: Polysulphone (PSF), glass-ﬁlled

Polyethersulphone (PES), glass-ﬁlled

Polyetherimide (PEI), glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

Plating: Gold over Nickel

N = Without Positioning Pin

P = With Positioning Pin

Protection Key**

K = With Protection Key

Unmarked = Without Protection Key

**Protection Key: Prevents IC from releasing during transportation

Series IC235 (Open Top)

SOP, TSOP Type II

0.8 and 1.27mm Pitch

Part Number (Details)

Speciﬁcations

Insulation Resistance:

1,000MΩ min. at 500V DC

201 *

IC235

020

Dielectric Withstanding Voltage: 700V AC for 1 minute

Contact Resistance:

30mΩ max. at 10mA/20mV max.

Series No.

Operating Temperature Range: –40°C to +150°C

Mating Cycles:

Contact Force:

10,000 insertions min.

20g to 80g per pin

No. of Contact Pins

Number of Sides

with Contacts

Materials and Finish

Housing: Polyetherimide (PEI), glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

Plating: Gold over Nickel

Design Number

Positioning Pin:

N = Without Positioning Pin

P = With Positioning Pin

40 ^{Test Solutions}

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE

–

DIMENSIONS IN MILLIMETER

12 3 4 5 6 7

中文翻译

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IC51-0564-680	YAMAICHI	获取价格	Series Overview QFP (Quad Flat Packages, Gullwing Leads)
IC51-0564-924	YAMAICHI	获取价格	Series Overview QFP (Quad Flat Packages, Gullwing Leads)
IC51-0604-361	YAMAICHI	获取价格	Series Overview QFP (Quad Flat Packages, Gullwing Leads)
IC51-0604-468	YAMAICHI	获取价格	Series Overview QFP (Quad Flat Packages, Gullwing Leads)

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