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IC189-0482-111 PDF预览

IC189-0482-111

更新时间： 2024-11-06 00:42:19
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
7页 444K
描述
SOP (Small Outline Packages, Gullwing Leads)

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中文翻译

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IC189-0482-111 数据手册

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Series Overview  
*SOP (Small Outline Packages, Gullwing Leads)  
SMT Devices  
*SOP variations e.g. TSSOP...  
Series IC51 (Clamshell)  
SOP, TSOP Type I & II  
0.4 to 1.27mm Pitch  
Part Number (Details)  
Specifications  
Insulation Resistance:  
1,000MΩ min. at 500V DC  
Dielectric Withstanding Voltage: 700V AC for 1 minute  
IC51  
Series No.  
- 028 2 - 334-1 - MF  
Contact Resistance:  
30mΩ max. at 10mA/20mV max.  
Operating Temperature Range:  
–40°C to +150°C (for type PSF)  
–55°C to +170°C (for type PES & PEI)  
10,000 insertions min.  
No. of Contact Pins  
Mating Cycles:  
No. of Sides with Contacts  
Design Number  
Materials and Finish  
Housing: Polyetherimide (PEI), glass-filled  
Contacts: Beryllium Copper (BeCu)  
Plating: Gold over Nickel  
MF= Flanged  
Unmarked = Not Flanged  
Series IC189 (Open Top)  
SOP, TSOP Type I & II  
0.4 to 1.27mm Pitch  
Specifications  
Part Number (Details)  
Insulation Resistance:  
1,000MΩ min. at 100V DC, pitch 0.4, 0.5  
1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27  
-
-
*
IC189  
016  
2
019 *  
Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, 0.5  
Series No.  
500V AC for 1 minute, pitch 0.65  
700V AC for 1 minute, pitch 0.8, 1.27  
30mΩ max. at 10mA/20mV max.  
No. of Contact Pins  
Contact Resistance:  
Operating Temperature Range: –40°C to +150°C  
Number of Sides  
with Contacts  
Mating Cycles:  
Contact Force:  
10,000 insertions  
20g to 80g per pin  
Design Number  
Materials and Finish  
Positioning Pin:  
Housing: Polysulphone (PSF), glass-filled  
Polyethersulphone (PES), glass-filled  
Polyetherimide (PEI), glass-filled  
Contacts: Beryllium Copper (BeCu)  
Plating: Gold over Nickel  
N = Without Positioning Pin  
P = With Positioning Pin  
Protection Key**  
K = With Protection Key  
Unmarked = Without Protection Key  
**Protection Key: Prevents IC from releasing during transportation  
Series IC235 (Open Top)  
SOP, TSOP Type II  
0.8 and 1.27mm Pitch  
Part Number (Details)  
Specifications  
Insulation Resistance:  
1,000MΩ min. at 500V DC  
-
-
-
201 *  
IC235  
020  
2
Dielectric Withstanding Voltage: 700V AC for 1 minute  
Contact Resistance:  
30mΩ max. at 10mA/20mV max.  
Series No.  
Operating Temperature Range: –40°C to +150°C  
Mating Cycles:  
Contact Force:  
10,000 insertions min.  
20g to 80g per pin  
No. of Contact Pins  
Number of Sides  
with Contacts  
Materials and Finish  
Housing: Polyetherimide (PEI), glass-filled  
Contacts: Beryllium Copper (BeCu)  
Plating: Gold over Nickel  
Design Number  
Positioning Pin:  
N = Without Positioning Pin  
P = With Positioning Pin  
40 Test Solutions  
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE  
–
DIMENSIONS IN MILLIMETER  
1234567

中文翻译

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