Datasheet > IC189-0482-111

IC189-0482-111

更新时间： 2024-11-25 00:42:19

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
7页	444K
描述
SOP (Small Outline Packages, Gullwing Leads)

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中文翻译

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数据手册

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IC189-0482-111 数据手册

Series Overview

*SOP (Small Outline Packages, Gullwing Leads)

SMT Devices

*SOP variations e.g. TSSOP...

Series IC51 (Clamshell)

SOP, TSOP Type I & II

0.4 to 1.27mm Pitch

Part Number (Details)

Speciﬁcations

Insulation Resistance:

1,000MΩ min. at 500V DC

Dielectric Withstanding Voltage: 700V AC for 1 minute

IC51

Series No.

- 028 2 - 334-1 - MF

Contact Resistance:

30mΩ max. at 10mA/20mV max.

Operating Temperature Range:

–40°C to +150°C (for type PSF)

–55°C to +170°C (for type PES & PEI)

10,000 insertions min.

No. of Contact Pins

Mating Cycles:

No. of Sides with Contacts

Design Number

Materials and Finish

Housing: Polyetherimide (PEI), glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

Plating: Gold over Nickel

MF= Flanged

Unmarked = Not Flanged

Series IC189 (Open Top)

SOP, TSOP Type I & II

0.4 to 1.27mm Pitch

Speciﬁcations

Part Number (Details)

Insulation Resistance:

1,000MΩ min. at 100V DC, pitch 0.4, 0.5

1,000MΩ min. at 500V DC, pitch 0.65, 0.8,1.27

IC189

016

019 *

Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.4, 0.5

Series No.

500V AC for 1 minute, pitch 0.65

700V AC for 1 minute, pitch 0.8, 1.27

30mΩ max. at 10mA/20mV max.

No. of Contact Pins

Contact Resistance:

Operating Temperature Range: –40°C to +150°C

Number of Sides

with Contacts

Mating Cycles:

Contact Force:

10,000 insertions

20g to 80g per pin

Design Number

Materials and Finish

Positioning Pin:

Housing: Polysulphone (PSF), glass-ﬁlled

Polyethersulphone (PES), glass-ﬁlled

Polyetherimide (PEI), glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

Plating: Gold over Nickel

N = Without Positioning Pin

P = With Positioning Pin

Protection Key**

K = With Protection Key

Unmarked = Without Protection Key

**Protection Key: Prevents IC from releasing during transportation

Series IC235 (Open Top)

SOP, TSOP Type II

0.8 and 1.27mm Pitch

Part Number (Details)

Speciﬁcations

Insulation Resistance:

1,000MΩ min. at 500V DC

201 *

IC235

020

Dielectric Withstanding Voltage: 700V AC for 1 minute

Contact Resistance:

30mΩ max. at 10mA/20mV max.

Series No.

Operating Temperature Range: –40°C to +150°C

Mating Cycles:

Contact Force:

10,000 insertions min.

20g to 80g per pin

No. of Contact Pins

Number of Sides

with Contacts

Materials and Finish

Housing: Polyetherimide (PEI), glass-ﬁlled

Contacts: Beryllium Copper (BeCu)

Plating: Gold over Nickel

Design Number

Positioning Pin:

N = Without Positioning Pin

P = With Positioning Pin

40 ^{Test Solutions}

SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE

–

DIMENSIONS IN MILLIMETER

12 3 4 5 6 7

中文翻译

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与IC189-0482-111相关器件

型号	品牌	获取价格	描述	数据表
IC189-0522-124	ETC	获取价格	SOP (Small Outline Packages, Gullwing Leads)
IC189-0542-088	ETC	获取价格	SOP (Small Outline Packages, Gullwing Leads)
IC189-0542-093	ETC	获取价格	SOP (Small Outline Packages, Gullwing Leads)
IC189-0542-093-K	YAMAICHI	获取价格	IC Socket, TSOP54, 54 Contact(s), 1.6002mm Term Pitch, 0.13/0.617inch Row Spacing, Solder
IC189-0562-067	ETC	获取价格	SOP (Small Outline Packages, Gullwing Leads)
IC189-0562-067-K	YAMAICHI	获取价格	IC Socket, TSOP56, 56 Contact(s), 1.4986mm Term Pitch, 0.13/0.944inch Row Spacing, Solder
IC189-0562-067N	YAMAICHI	获取价格	IC Socket, TSOP56, 56 Contact(s), 1.4986mm Term Pitch, 0.13/0.944inch Row Spacing, Solder
IC189-0562-078-K	YAMAICHI	获取价格	IC Socket, TSOP56, 56 Contact(s), 1.4986mm Term Pitch, 0.13/0.958inch Row Spacing, Solder
IC189-0562-078N	YAMAICHI	获取价格	IC Socket, TSOP56, 56 Contact(s), 1.4986mm Term Pitch, 0.13/0.958inch Row Spacing, Solder
IC189-0562-078N-K	YAMAICHI	获取价格	IC Socket, TSOP56, 56 Contact(s), 1.4986mm Term Pitch, 0.13/0.958inch Row Spacing, Solder

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