Extreme Rugged™ COM Express® Type 6 Module with
3rd Generation Intel® Core™ i3/i7 Processor
Express-IBR
Features
Quad/dual core 3rd Generation Intel® Core™
Processor
Mobile Intel® QM77 Express Chipset
Up to 16GB ECC 1600MHz DDR3 memory in two
SODIMM sockets
Three Digital Display Interfaces (DDI) for
DisplayPort /HDMI/DVI/SDVO
Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for
graphics (or general purpose x8/4/1)
2x SATA 6 Gb/s, 2x SATA 3 Gb/s, Gigabit Ethernet,
USB 2.0, 4 USB 3.0
COM Express® COM.0 R2.1 Type 6 Pinout
Extended Temperature: -40°C to +85°C
50% Thicker PCB for high vibration environments
Specifications
Multi I/O
Chipset
Core System
CPU
Integrated on Mobile Intel® QM77 Express chipset
Supports up to eight ports USB 2.0, 4 USB 3.0
3rd Generation Intel® Core™ i7/i3, 22nm process, BGA type
Intel® Core™ i7-3615QE 2.3GHz (up to 3.3GHz Turbo), 6MB
USB
L3 cache, 45W, quad core
SATA
Two SATA 6 Gb/s, two SATA 3 Gb/s with support for RAID
0,1,5,10
Intel® Core™ i7-3612QE 2.1GHz (up to 3.1GHz Turbo), 6MB
L3 cache, 35W, quad core
Intel® Core™ i7-3555LE 2.5GHz (up to 3.2GHz Turbo), 4MB
L3 cache, 25W, dual core
Intel® Core™ i7-3517UE 1.7GHz (up to 2.8GHz Turbo), 4MB
L3 cache, 17W, dual core
Intel® Core™ i3-3217UE 1.6GHz, 3MB
L3 cache, 17W, dual core
Dual channel ECC 1600 MHz DDR3 memory up to 16 GB in
dual SODIMM sockets
Super I/O
Connected to LPC bus on carrier if needed (BIOS supports
W83627DHG)
TPM (optional)
Chipset
Atmel AT97SC3204-U1A190
TPM 1.2
Memory
Type
BIOS
AMI EFI with CMOS backup in 16 Mb SPI flash
Supply voltages and CPU temperature
XDP SFF-26 extension for ICE debug
Programmable timer range to generate RESET
PCI Express x16 (Gen3) bus for discrete graphics solution or
general purpose PCI Express (2 x8 or 1 x8 with 2 x4)
Power
Input Power
Hardware Monitor
Debug Interface
Watchdog Timer
Expansion Busses
AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Power States
Supports S0, S1, S3, S4, S5
12W typical (i7-36xxQE)
8W typical (i7-3555LE/i7-3517UE/i3-3217UE)
S3: 0.85W
Power Consumption
7 PCI Express x1: Lanes 0/1/2/3/4/5/6
LPC bus, SMBus (system), I2C (user)
S5: 0.55W
Technologies
PAVP 3.0, Intel® AMT 8.0, Intel® VT, Intel® AES-NI, Intel® HT,
Intel® HD Graphics with Dynamic Frequency, Intel® Turbo
Boost , Dynamic Turbo, Intel® AVX 1.0, Intel® Quick Sync Video
Smart Battery Support Yes (BIOS supports LTC4100 and LTC1760)
Mechanical and Environmental
Size
COM Express Basic, 125 mm x 95 mm
Video
Integrated in Processor Intel® HD Graphics 4000 at 650-1300 MHz
Board Thickness
0.093” (2.3mm)
Operating Temperature Standard: -20°C to 70°C
Extended: -40°C to 85°C
Integrated Video
Media Processing
DirectX 11.0, OpenGL 3.1, and OCL 1.1
Decode (HW JPEG & MJPEG decode), encode (full HW
MPEG2 encode), transcode
Intel® Clear Video HD Technology + enhanced media
Storage Temperature
Humidity
-55°C to 85°C
90% at 60°C non-condensing
processing
Shock
50G peak-to-peak, 11ms duration, MIL-STD-202G Method
213B
VGA Interface
LVDS Interface
Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and VGA
hot plug
Vibration
Operating: 11.96 Grms, 50-20,000 Hz, each axis,
MIL-STD-202G Method 214A
Compatibility
Certifications
PICMG COM Express COM.0 R2.1 Type 6
CE, FCC, HALT
Dual channel 18/24-bit LVDS
Digital Display Interface Three DDI ports supporting HDMI / DVI / DisplayPort or SDVO
Operating Systems
Audio
Chipset
Standard Support
Windows 7
Integrated on Mobile Intel® QM77 Express chipset
Implemented on carrier board
Linux
Audio Codec
Extended Support (BSP) Windows XPe/7, WEC 7
Linux, VxWorks 6.9, QNX 6.5
AIDI Library
Ethernet
Chipset
Intel® Gigabit LAN PHY WG82579LM
Speed
10/100/1000 Mbps Ethernet
17
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