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IBM25PPC750GLECB2HA3T PDF预览

IBM25PPC750GLECB2HA3T

更新时间: 2024-02-27 00:15:36
品牌 Logo 应用领域
国际商业机器公司 - IBM 时钟外围集成电路
页数 文件大小 规格书
76页 1031K
描述
RISC Microprocessor, 32-Bit, 800MHz, CMOS, CBGA292, 21 X 21 MM, 1 MM PITCH, ROHS COMPLIANT, CERAMIC, BGA-292

IBM25PPC750GLECB2HA3T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:BGA,针数:292
Reach Compliance Code:unknownECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.66
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:200 MHz
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-CBGA-B292
JESD-609代码:e1长度:21 mm
低功率模式:YES端子数量:292
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:BGA
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
座面最大高度:2.828 mm速度:800 MHz
最大供电电压:1.55 V最小供电电压:1.45 V
标称供电电压:1.5 V表面贴装:YES
技术:CMOS端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:21 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

IBM25PPC750GLECB2HA3T 数据手册

 浏览型号IBM25PPC750GLECB2HA3T的Datasheet PDF文件第2页浏览型号IBM25PPC750GLECB2HA3T的Datasheet PDF文件第3页浏览型号IBM25PPC750GLECB2HA3T的Datasheet PDF文件第4页浏览型号IBM25PPC750GLECB2HA3T的Datasheet PDF文件第5页浏览型号IBM25PPC750GLECB2HA3T的Datasheet PDF文件第6页浏览型号IBM25PPC750GLECB2HA3T的Datasheet PDF文件第7页 
IBM PowerPC 750GL RISC Microprocessor  
Revision Level DD1.X  
Datasheet  
Version: 1.2  
Preliminary  
March 13, 2006  

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