生命周期: | Obsolete | 零件包装代码: | QFP |
包装说明: | FQFP, | 针数: | 240 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.71 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 75 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
JESD-30 代码: | S-CQFP-G240 | 长度: | 32 mm |
低功率模式: | YES | 端子数量: | 240 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | FQFP |
封装形状: | SQUARE | 封装形式: | FLATPACK, FINE PITCH |
认证状态: | Not Qualified | 座面最大高度: | 4.1 mm |
速度: | 240 MHz | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 宽度: | 32 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IBM25PPC604E3BB--300E | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC604E3BB--350E | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC604E3DB--250E | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 250MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC604E3DB--300E | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC604E3DB--350E | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC620BE133 | IBM |
获取价格 |
Microprocessor, | |
IBM25PPC740-DB0M2250 | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 225MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC740-DB0M2500 | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 250MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC740-DB0M2750 | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 275MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG | |
IBM25PPC740-DB0M3000 | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BG |