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IBM25PPC740-DB0M2250 PDF预览

IBM25PPC740-DB0M2250

更新时间: 2024-02-16 02:44:38
品牌 Logo 应用领域
国际商业机器公司 - IBM 时钟外围集成电路
页数 文件大小 规格书
42页 496K
描述
RISC Microprocessor, 32-Bit, 225MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360

IBM25PPC740-DB0M2250 技术参数

生命周期:Contact Manufacturer零件包装代码:BGA
包装说明:BGA,针数:360
Reach Compliance Code:unknownECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.34
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:83.3 MHz
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:NOJESD-30 代码:S-CBGA-B360
长度:25 mm低功率模式:YES
端子数量:360最高工作温度:65 °C
最低工作温度:封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY认证状态:Not Qualified
座面最大高度:3.2 mm速度:225 MHz
最大供电电压:2.75 V最小供电电压:2.65 V
标称供电电压:2.7 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:25 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

IBM25PPC740-DB0M2250 数据手册

 浏览型号IBM25PPC740-DB0M2250的Datasheet PDF文件第2页浏览型号IBM25PPC740-DB0M2250的Datasheet PDF文件第3页浏览型号IBM25PPC740-DB0M2250的Datasheet PDF文件第4页浏览型号IBM25PPC740-DB0M2250的Datasheet PDF文件第5页浏览型号IBM25PPC740-DB0M2250的Datasheet PDF文件第6页浏览型号IBM25PPC740-DB0M2250的Datasheet PDF文件第7页 
Preliminary Copy  
PowerPC 750TM SCM RISC Microprocessor  
Advance Information  
PowerPC 750TM SCM RISC Microprocessor  
Datasheet  
TM  
TM  
The PowerPC 750 microprocessor is an implementation of the PowerPC family of reduced instruction  
set computer (RISC) microprocessors. In this document, the term “750” is used as an abbreviation for the  
TM  
phrase “PowerPC 750 microprocessor.” This document contains pertinent physical characteristics of the  
750 Single Chip Modules (SCM).  
This document contains the following topics.  
Topic  
Page  
Overview...................................................................................................................................................... 2  
Features ...................................................................................................................................................... 3  
General Parameters .................................................................................................................................... 6  
Electrical and Thermal Characteristics........................................................................................................ 7  
PowerPC 750 Microprocessor Pin Assignments....................................................................................... 23  
PowerPC 750 Microprocessor Pinout Listings .......................................................................................... 24  
PowerPC 750 Microprocessor Package Description................................................................................. 27  
System Design Information ....................................................................................................................... 29  
Ordering Information.................................................................................................................................. 41  
The PowerPC name, the PowerPC logotype, and PowerPC 750 are trademarks of International Business Machines Corporation.  
This document contains information on a new product under development by IBM. IBM reserves the right to change or discontinue this product with-  
out notice.  
© IBM Corporation, 1998  
Portions hereof © International Business Machines Corporation, 1991-1998. All rights reserved.  
7/15/99  
v 3.2  
Datasheet  
Page 1  

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MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC