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IBM0436A41QLAA-5 PDF预览

IBM0436A41QLAA-5

更新时间: 2024-02-04 16:26:05
品牌 Logo 应用领域
其他 - ETC 静态存储器
页数 文件大小 规格书
25页 325K
描述
x36 Fast Synchronous SRAM

IBM0436A41QLAA-5 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:End Of Life零件包装代码:BGA
包装说明:BGA, BGA119,7X17,50针数:119
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.86
最长访问时间:2.25 nsI/O 类型:COMMON
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:4718592 bit
内存集成电路类型:STANDARD SRAM内存宽度:36
功能数量:1端子数量:119
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:128KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA119,7X17,50
封装形状:RECTANGULAR封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.5,3.3 V认证状态:Not Qualified
座面最大高度:2.679 mm最大待机电流:0.065 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.37 mA最大供电电压 (Vsup):3.63 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

IBM0436A41QLAA-5 数据手册

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IBM0418A81QLAA IBM0436A81QLAA  
IBM0418A41QLAA IBM0436A41QLAA  
8Mb (256Kx36 & 512x18) and 4Mb (128Kx36 & 256Kx18) SRAM  
Features  
• 8Mb: 256K x 36 or 512K x 18 organizations  
4Mb: 128K x 36 or 256K x 18 organizations  
• Registered Outputs  
• Common I/O  
• 0.25 Micron CMOS technology  
• Asynchronous Output Enable a  
• Synchronous Power Down Inputs  
• Synchronous Pipeline Mode of Operation with  
Self-Timed Late Write  
• Single Differential Extended HSTL Clock  
• Boundary Scan using limited set of JTAG  
1149.1 functions  
• +3.3V Power Supply, Ground, 1.5V V  
, and  
DDQ  
• Byte Write Capability and Global Write Enable  
0.75V V  
REF  
• 7 x 17 Bump Ball Grid Array Package with  
SRAM JEDEC Standard Pinout and Boundary  
SCAN Order  
• HSTL Inputs and Output levels  
• Registered Addresses, Write Enables, Synchro-  
nous Select, and Data Ins  
Description  
The 4Mb and 8Mb SRAMs—IBM0436A41QLAA,  
IBM0418A41QLAA, IBM0418A81QLAA, and  
IBM0436A81QLAA—are Synchronous Pipeline  
Mode, high-performance CMOS Static Random  
Access Memories that are versatile, have wide I/O,  
and can achieve 3ns cycle times. Differential K  
clocks are used to initiate the read/write operation  
and all internal operations are self-timed. At the ris-  
ing edge of the K clock, all Addresses, Write-  
Enables, Sync Select, and Data Ins are registered  
internally. Data Outs are updated from output regis-  
ters off the next rising edge of the K clock. An inter-  
nal Write buffer allows write data to follow one cycle  
after addresses and controls. The chip is operated  
with a single +3.3V power supply and is compatible  
with HSTL I/O interfaces.  
trrh3316.06  
12/00  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
Page 1 of 25  

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