Datasheet > I1730EYI01

I1730EYI01

更新时间： 2024-02-18 13:58:39

品牌	Logo	应用领域
华邦 - WINBOND		光电二极管商用集成电路
页数	文件大小	规格书
24页	351K
描述
Speech Synthesizer With RCDG, 60s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

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技术参数
数据手册

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I1730EYI01 技术参数

生命周期：	Obsolete	零件包装代码：	TSOP
包装说明：	TSOP1,	针数：	28
Reach Compliance Code：	unknown	HTS代码：	8542.39.00.01
风险等级：	5.61	Is Samacsys：	N
商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG	JESD-30 代码：	R-PDSO-G28
JESD-609代码：	e3	长度：	11.8 mm
功能数量：	1	端子数量：	28
片上内存类型：	FLASH	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	TSOP1	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE	认证状态：	Not Qualified
最长读取时间：	60 s	座面最大高度：	1.2 mm
最大供电电压 (Vsup)：	5.5 V	最小供电电压 (Vsup)：	2.4 V
表面贴装：	YES	温度等级：	INDUSTRIAL
端子面层：	MATTE TIN	端子形式：	GULL WING
端子节距：	0.55 mm	端子位置：	DUAL
宽度：	8 mm	Base Number Matches：	1

I1730EYI01 数据手册

ISD1700 SERIES

12 ORDERING INFORMATION

Product Number Descriptor Key

I17xxxxxxxxx

Special Features Field:

Product Name:

Blank = None

I = ISD

= vAlert

Product Series:

Tape & Reel:

17 = 1700

Blank = None

Duration:

= Tape & Reel

30 : 20 – 60 secs

40 : 26 – 80 secs

50 : 33 – 100 secs

60 : 40 – 120 secs

90 : 60 – 180 secs

120 : 80 – 240 secs

150 : 100 – 300 secs

180 : 120 – 360 secs

210 : 140 – 420 secs

240 : 160 – 480 secs

Temperature:

Industrial (-40°C to +85°C)

Blank = Commercial

•

Die (0°C to +50°C)

Package (0°C to +70°C)

Package Type:

Die

Lead-Free:

= Lead-Free

Thin Small Outline Package (TSOP)

Small Outline Integrated Circuit

(SOIC) Package

Plastic Dual Inline Package (PDIP)

When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond

Sales Representatives for any questions and the availability.

For the latest product information, please contact the Winbond Sales/Rep or

access Winbond’s worldwide web site at http://www.winbond-usa.com

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