5秒后页面跳转
I1730SYR PDF预览

I1730SYR

更新时间: 2024-02-29 18:19:55
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 60s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28

I1730SYR 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:SOP,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.68
商用集成电路类型:SPEECH SYNTHESIZER WITH RCDGJESD-30 代码:R-PDSO-G28
JESD-609代码:e3长度:17.93 mm
湿度敏感等级:3功能数量:1
端子数量:28片上内存类型:FLASH
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260最长读取时间:60 s
座面最大高度:2.64 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:YES
温度等级:COMMERCIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.52 mmBase Number Matches:1

I1730SYR 数据手册

 浏览型号I1730SYR的Datasheet PDF文件第2页浏览型号I1730SYR的Datasheet PDF文件第3页浏览型号I1730SYR的Datasheet PDF文件第4页浏览型号I1730SYR的Datasheet PDF文件第5页浏览型号I1730SYR的Datasheet PDF文件第6页浏览型号I1730SYR的Datasheet PDF文件第7页 
PRELIMINARY  
ISD1700  
Series  
Multi-Message  
Single-Chip  
Voice Record & Playback Devices  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  

与I1730SYR相关器件

型号 品牌 描述 获取价格 数据表
I1730SYR01 WINBOND Speech Synthesizer With RCDG, 60s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28

获取价格

I1730XY WINBOND Speech Synthesizer With RCDG, 60s, DIE

获取价格

I1730XY01 WINBOND Speech Synthesizer With RCDG, 60s, DIE

获取价格

I1730XYI WINBOND Speech Synthesizer With RCDG, 60s, DIE

获取价格

I1730XYI01 WINBOND Speech Synthesizer With RCDG, 60s, DIE

获取价格

I1730XYIR WINBOND Speech Synthesizer With RCDG, 60s, DIE

获取价格