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I1730PYI PDF预览

I1730PYI

更新时间: 2024-01-04 21:14:03
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 60s, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28

I1730PYI 技术参数

是否Rohs认证: 符合生命周期:Contact Manufacturer
包装说明:DIP,Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.68
商用集成电路类型:SPEECH SYNTHESIZER WITH RCDGJESD-30 代码:R-PDIP-T28
JESD-609代码:e3长度:36.83 mm
湿度敏感等级:3功能数量:1
端子数量:28片上内存类型:FLASH
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED最长读取时间:60 s
座面最大高度:4.83 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:NO
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15.24 mmBase Number Matches:1

I1730PYI 数据手册

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PRELIMINARY  
ISD1700  
Series  
Multi-Message  
Single-Chip  
Voice Record & Playback Devices  
Publication Release Date: January 23, 2007  
Revision 1.3-S2  

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