Datasheet > I17150SYR

I17150SYR

更新时间： 2024-01-19 20:31:26

品牌	Logo	应用领域
华邦 - WINBOND		光电二极管商用集成电路
页数	文件大小	规格书
24页	351K
描述
Speech Synthesizer With RCDG, 300s, PDSO28, 0.300 INCH, LEAD FREE, PLASTIC, SOIC-28

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技术参数
数据手册

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I17150SYR 技术参数

生命周期：	Obsolete	零件包装代码：	DIE
包装说明：	DIE,	Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01	风险等级：	5.83
商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG	JESD-30 代码：	X-XUUC-N
功能数量：	1	片上内存类型：	FLASH
最高工作温度：	50 °C	最低工作温度：
封装主体材料：	UNSPECIFIED	封装代码：	DIE
封装形状：	UNSPECIFIED	封装形式：	UNCASED CHIP
认证状态：	Not Qualified	最长读取时间：	300 s
最大供电电压 (Vsup)：	5.5 V	最小供电电压 (Vsup)：	2.4 V
表面贴装：	YES	温度等级：	COMMERCIAL
端子形式：	NO LEAD	端子位置：	UPPER
Base Number Matches：	1

I17150SYR 数据手册

ISD1700 SERIES

Example #3: Connecting the SPI Interface to a microcontroller

Reset

REC

RESET

PLAY

ERASE

0.1μF

vAlert

1 KΩ

LED

FWD

Vcc

Gnd

V_CCD

V_CCA

V_CCD

V_CCP

VOL

V_CCD

V_SSD

0.1

V_CCA

V_SSA

0.1

V_CCP

SCLK

MOSI

MISO

V_CCP

To uC

SPI

ISD1700

V_SSP1

0.1

V_SSP2

Speaker

or Buzzer

V_CC

SP+

SP-

MIC+

MIC -

Speaker

AUD

AUX

0.1μF

AUD/AUX

INT/RDY

8050C

AnaIn

V_CCD

100 KΩ

Optional

Rosc ***

390

R_OSC

AGC

0.1μ F

4.7

Optional: based upon the applications

*** At 8kHz sampling freq, Rosc = 80 K

: Digital ground;

: Analog ground;

: Ground for SP+;

: Ground for SP-

10.1

GOOD AUDIO DESIGN PRACTICES

To ensure the highest quality of voice reproduction, it is important to follow good audio design

practices in layout and power supply decoupling. See recommendations from below links or other

Application Notes in our websites.

Design Considerations for ISD1700 Family

AN-CC1002 Design Considerations for ISD1700 Family.pdf

Good Audio Design Practices

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf

Single-Chip Board Layout Diagrams

http://www.winbond-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf

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