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HY6264ALJ-100 PDF预览

HY6264ALJ-100

更新时间: 2024-11-30 14:42:39
品牌 Logo 应用领域
海力士 - HYNIX 静态存储器光电二极管内存集成电路
页数 文件大小 规格书
9页 128K
描述
Standard SRAM, 8KX8, 100ns, CMOS, PDSO28, 0.330 INCH, SOP-28

HY6264ALJ-100 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP,针数:28
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.41风险等级:5.69
最长访问时间:100 nsJESD-30 代码:R-PDSO-G28
长度:18.39 mm内存密度:65536 bit
内存集成电路类型:STANDARD SRAM内存宽度:8
功能数量:1端口数量:1
端子数量:28字数:8192 words
字数代码:8000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:8KX8可输出:YES
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:PARALLEL认证状态:Not Qualified
座面最大高度:2.794 mm最小待机电流:2 V
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL宽度:8.69 mm
Base Number Matches:1

HY6264ALJ-100 数据手册

 浏览型号HY6264ALJ-100的Datasheet PDF文件第2页浏览型号HY6264ALJ-100的Datasheet PDF文件第3页浏览型号HY6264ALJ-100的Datasheet PDF文件第4页浏览型号HY6264ALJ-100的Datasheet PDF文件第5页浏览型号HY6264ALJ-100的Datasheet PDF文件第6页浏览型号HY6264ALJ-100的Datasheet PDF文件第7页 
HY6264A Series  
8Kx8bit CMOS SRAM  
minimize current drain is unnecessary for the  
HY6264A Series.  
DESCRIPTION  
FEATURES  
The HY6264A is a high-speed, low power and  
8,192x8-bits CMOS static RAM fabricated using  
Hyundai's high performance twin tub CMOS  
process technology. This high reliability process  
coupled with innovative circuit design techniques,  
yields maximum access time of 70ns. The  
HY6264A has a data retention mode that  
guarantees data to remain valid at the minimum  
power supply voltage of 2.0 volt. Using the CMOS  
technology, supply voltage from 2.0 to 5.5 volt  
has little effect on supply current in the data  
retention mode. Reducing the supply voltage to  
·
·
·
·
Fully static operation and Tri-state outputs  
TTL compatible inputs and outputs  
Low power consumption  
Battery backup(L/LL-part)  
-2.0V(min.) data retention  
Standard pin configuration  
-28 pin 600 mil PDIP  
·
-28 pin 330 mil SOP  
Product  
No.  
HY6264A  
Voltage  
(V)  
Speed  
(ns)  
70/85/100  
Operation  
Current(mA)  
50  
Standby Current(uA)  
Temperature  
(°C)  
0~70(Normal)  
L
100  
LL  
10  
5.0  
1mA  
Note 1. Current value is max.  
PIN CONNECTION  
BLOCK DIAGRAM  
ROW DECODER  
I/O1  
A0  
Vcc  
NC  
A12  
A7  
1
2
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
NC  
A12  
A7  
Vcc  
/WE  
CS2  
A8  
1
2
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
/WE  
CS2  
A8  
3
3
A6  
4
A6  
4
A9  
A5  
5
A5  
A9  
5
MEMORY ARRAY  
128x512  
A4  
A11  
/OE  
A10  
/CS1  
I/O8  
I/O7  
I/O6  
I/O5  
I/O4  
6
A11  
/OE  
A10  
/CS1  
I/O8  
I/O7  
I/O6  
I/O5  
I/O4  
A4  
6
A3  
7
A3  
7
A2  
8
A2  
8
A1  
A1  
9
9
A0  
10  
11  
12  
13  
14  
A0  
10  
11  
12  
13  
14  
A12  
I/O1  
I/O2  
I/O3  
Vss  
I/O8  
I/O1  
I/O2  
I/O3  
Vss  
/CS1  
CS2  
/OE  
PDIP  
SOP  
/WE  
PIN DESCRIPTION  
Pin Name  
/CS1  
Pin Function  
Chip Select 1  
Chip Select 2  
Write Enable  
Output Enable  
Address Inputs  
Pin Name  
Pin Function  
Data Input/Output  
Power(+5V)  
I/O1-I/O8  
Vcc  
CS2  
/WE  
Vss  
Ground  
/OE  
NC  
No Connect  
A0-A12  
This document is a general product description and is subject to change without notice. Hyundai Electronics does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev.02 /Jan.99  
Hyundai Semiconductor  

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