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HY5W26DF-H PDF预览

HY5W26DF-H

更新时间: 2024-02-26 04:15:53
品牌 Logo 应用领域
海力士 - HYNIX 动态存储器内存集成电路
页数 文件大小 规格书
13页 259K
描述
Synchronous DRAM, 8MX16, 5.4ns, CMOS, PBGA54, 0.80 MM PITCH, FBGA-54

HY5W26DF-H 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA,针数:54
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.71
访问模式:FOUR BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:S-PBGA-B54
JESD-609代码:e1长度:8 mm
内存密度:134217728 bit内存集成电路类型:SYNCHRONOUS DRAM
内存宽度:16功能数量:1
端口数量:1端子数量:54
字数:8388608 words字数代码:8000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:8MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:SQUARE封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
认证状态:Not Qualified座面最大高度:1.2 mm
自我刷新:YES最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM宽度:8 mm
Base Number Matches:1

HY5W26DF-H 数据手册

 浏览型号HY5W26DF-H的Datasheet PDF文件第1页浏览型号HY5W26DF-H的Datasheet PDF文件第3页浏览型号HY5W26DF-H的Datasheet PDF文件第4页浏览型号HY5W26DF-H的Datasheet PDF文件第5页浏览型号HY5W26DF-H的Datasheet PDF文件第6页浏览型号HY5W26DF-H的Datasheet PDF文件第7页 
Preliminary  
HY5W26D(L)F(P)-H  
4Banks x 2M x 16bits Synchronous DRAM  
DESCRIPTION  
The Hynix HY5W26D(L)F(P)-H is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the memory applica-  
tions which require wide data I/O and high bandwidth. HY5W26D(L)F(P)-H is organized as 4banks of 2,097,152x16.  
HY5W26D(L)F(P)-H is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and  
outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve  
very high bandwidth. All input and output voltage levels are compatible with LVTTL.  
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write  
cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(se-  
quential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate command or  
can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not re-  
stricted by a '2N' rule)  
FEATURES  
Voltage : VDD, VDDQ 2.5V supply voltage  
All device pins are compatible with LVTTL interface  
54Ball FBGA  
Auto refresh and self refresh  
4096 Refresh cycles / 64ms  
Programmable Burst Length and Burst Type  
- 1, 2, 4, 8 or full page for Sequential Burst  
- 1, 2, 4 or 8 for Interleave Burst  
Programmable CAS Latency ; 2, 3 Clocks  
Burst Read Single Write operation  
All inputs and outputs referenced to positive edge of  
system clock  
Data mask function by UDQM, LDQM  
Internal four banks operation  
ORDERING INFORMATION  
Clock  
CAS  
Latency  
Part No.  
Power  
Organization  
Package  
Frequency  
HY5W26DF-H  
54Ball FBGA, Lead  
Normal  
HY5W26DFP-H  
HY5W26DLF-H  
HY5W26DLFP-H  
54Ball FBGA, Lead Free  
54Ball FBGA, Lead  
4Banks x 2Mbits  
x16  
133MHz  
3
Low  
power  
54Ball FBGA, Lead Free  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev. 0.2 / Apr. 2004  
2

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