THICK FILM
SMD
hVc Sꢀꢁꢂꢀs
Precision High-Value High-voltage Wraparound Chip
f e at u r e S
•ꢀHighꢀvalueꢀchipꢀresistorsꢀinꢀthickꢀfilmꢀtechnology
•ꢀLowꢀtemperatureꢀandꢀvoltageꢀdependencyꢀ(lowꢀTCRꢀandꢀVCR)
•ꢀHighꢀworkingꢀvoltageꢀupꢀtoꢀ3000V
•ꢀSuitableꢀforꢀhighꢀvacuumꢀapplications—noꢀorganics
•ꢀContactꢀareas:ꢀNickel-barrier/matteꢀtin
•ꢀWraparoundꢀterminals
SerieS SpecificationS
Wattage1
P70 (mW)
Oper. Voltage (V)
std. untrimmed (≥5%)
Resistance
Range
TCR2
(ppm)
VCR2
(ppm)
Series
Type
Tolerance
HVC0805---
0805
125
200
600
1000
3000
100K-100M 0.5-10%
25, 50, 100
50, 100, 250
100, 250
1000, 2000
25, 50, 100
50, 100, 250
100, 250
500, 1000
25, 50, 100
25, 50, 100
50, 100
50
250
500
1000
50
100
250
1000
10
>100M-1G
>1G-10G
2-20%
5-20%
>10G-100G 10-30%
100K-100M 0.5-10%
HVC1206---
HVC2512---
1206
2512
250
600
>100M-1G
>1G-10G
2-20%
5-20%
>10G-100G 10-30%
100K-100M 0.5-10%
1000
2000
>100M-1G
>1G-10G
>10G-100G
1-20%
2-20%
5-30%
25
100
250
250, 500
1. At continuous power dissipation the dimensions of the solder pads have to be capable of sufficient heat conduction.
2. Not all TCR/VCR combinations available in all resistance values
characteriSticS
Operating temperature -55°C ~ +155°C
Derating
range
100
80
60
40
20
0
Climatic category 55/155/56, acc. to EN 60068-1
Solderability 250°C, 3s, acc. to EN 60068-2-58
Max. soldering temperature 260°C, 10s, acc. to IEC 68-2-58
Long Term Stability
<1G
<10G
≥1G
Load Life 70°C/1000h <0.25% <0.5% <1%
Storage 125°C/1000h <0.5% <1%
Max. Voltage/1000h <0.5% <1%
-55
0
50 70 100
155
<2%
<2%
Data not specified according to EN 140401-802 (CECC 40401-802)
terminal DetailS
Base Metal PtAg
Termination Finish 100% electroplated matte Sn100
Thickness of Finish 5 microns
Barrier Material between Base Metal and Finish Porosity-free Ni (5-8 microns thickness)
Baking/Annealing Process after Sn Plating 150°C; > 4 hours
Peak Process Body Temperature (Classification 260°C for 10 seconds
Temperature) and Maximum Time
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