Datasheet > HV509K6-G-M932

HV509K6-G-M932

更新时间： 2024-01-27 00:46:43

品牌	Logo	应用领域
美国微芯 - MICROCHIP		驱动接口集成电路
页数	文件大小	规格书
8页	551K
描述
IC 16BIT SRL PARALLEL 32VQFN

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

HV509K6-G-M932 技术参数

是否无铅：	不含铅	生命周期：	Active
包装说明：	HVQCCN,	Reach Compliance Code：	compliant
Factory Lead Time：	3 weeks	风险等级：	5.71
内置保护：	TRANSIENT	接口集成电路类型：	SIPO BASED PERIPHERAL DRIVER
JESD-30 代码：	S-XQCC-N32	长度：	5 mm
功能数量：	1	端子数量：	32
最高工作温度：	70 °C	最低工作温度：
输出电流流向：	SOURCE AND SINK	封装主体材料：	UNSPECIFIED
封装代码：	HVQCCN	封装形状：	SQUARE
封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	座面最大高度：	1 mm
最大供电电压：	5.5 V	最小供电电压：	2 V
标称供电电压：	3 V	表面贴装：	YES
技术：	CMOS	温度等级：	COMMERCIAL
端子形式：	NO LEAD	端子节距：	0.5 mm
端子位置：	QUAD	宽度：	5 mm
Base Number Matches：	1

HV509K6-G-M932 数据手册

HV509

32-Lead QFN Package Outline (K6)

5.00x5.00mm body, 1.00mm height (max), 0.50mm pitch

Note 1

(Index Area

D/2 x E/2)

Note 1

(Index Area

D/2 x E/2)

View B

Top View

Bottom View

Note 3

Seating

Plane

Note 2

Side View

View B

Notes:

1. A Pin 1 identiﬁer must be located in the index area indicated. The Pin 1 Identiﬁer can be: a molded mark/identiﬁer; an embedded metal marker; or

a printed indicator.

2. Depending on the method of manufacturing, a maximum of 0.15mm pullback (L1) may be present.

3. The inner tip of the lead may be either rounded or square.

Symbol

1.05

0.00

0^O

MIN

NOM

MAX

0.80

0.90

1.00

0.00

0.02

0.05

0.18

0.25

0.30

4.85*

5.00

4.85*

5.00

0.30^†

0.40^†

0.50^†

Dimension

(mm)

0.20

REF

0.50

BSC

5.15* 3.55^†5.15* 3.55^†

0.15

14^O

JEDEC Registration MO-220, Variation VHHD-6, Issue K, June 2006.

* This dimension is not speciﬁed in the original JEDEC drawing. The value listed is for reference only.

† This dimension is a non-JEDEC dimension.

Drawings not to scale.

Supertex Doc. #: DSPD-32QFNK65X5P050, Version B090808.

(The package drawing(s) in this data sheet may not reﬂect the most current speciﬁcations. For the latest package outline information go to http://www.

supertex.com/packaging.html.)

Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives an

adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability to the

replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and specifications

are subject to change without notice. For the latest product specifications refer to the Supertex inc. website: http//www.supertex.com.

1235 Bordeaux Drive, Sunnyvale, CA 94089

Tel: 408-222-8888

Doc.# DSFP-HV509

A091908

www.supertex.com

1...5 6 78

中文翻译

下载PDF

与HV509K6-G-M932相关器件

型号	品牌	描述	获取价格	数据表
HV50P	EDI	HIGH VOLTAGE RECTIFIERS ULTRA-MINIATURE AND MINIATURE	获取价格
HV-50V100ME61EQ-R2	TAIYO YUDEN	FOR AUTOMOTIVE CONDUCTIVE POLYMER HYBRID ALUMINUM ELECTROLYTIC CAPACITORS[HV]	获取价格
HV-50V100ME61E-R2	TAIYO YUDEN	CONDUCTIVE POLYMER HYBRID ALUMINUM ELECTROLYTIC CAPACITORS[HV]	获取价格
HV-50V100ME61Q-R2	TAIYO YUDEN	FOR AUTOMOTIVE CONDUCTIVE POLYMER HYBRID ALUMINUM ELECTROLYTIC CAPACITORS[HV]	获取价格
HV-50V100ME61-R2	TAIYO YUDEN	CONDUCTIVE POLYMER HYBRID ALUMINUM ELECTROLYTIC CAPACITORS[HV]	获取价格
HV-50V101MH10EQ-R2	TAIYO YUDEN	FOR AUTOMOTIVE CONDUCTIVE POLYMER HYBRID ALUMINUM ELECTROLYTIC CAPACITORS[HV]	获取价格

与HV509K6-G-M932相关文章

深入解析CS8416引脚说明、参数、技术特点
2024-06-03

1
TPA3116D2功放芯片参数详解、引脚说明
2024-06-03

5
移位寄存器74HC165引脚说明、驱动程序示例解读
2024-06-03

4
深入解析AD9833：DDS频率合成器的卓越性能与广泛应用
2024-06-03

2

产品中心

服务支持

精选活动

关于我们

帮助中心

HV509K6-G-M932

HV509K6-G-M932 技术参数

HV509K6-G-M932 数据手册

与HV509K6-G-M932相关器件

与HV509K6-G-M932相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

HV509K6-G-M932

HV509K6-G-M932 技术参数

HV509K6-G-M932 数据手册

与HV509K6-G-M932相关器件

与HV509K6-G-M932相关文章

您还可以找

您在本页遇到什么问题？