HUF76609D3, HUF76609D3S
Data Sheet
October 1999
File Number 4688.2
10A, 100V, 0.165 Ohm, N-Channel, Logic
Level UltraFET Power MOSFET
Packaging
Features
JEDEC TO-251AA
JEDEC TO-252AA
• Ultra Low On-Resistance
- r
- r
= 0.160Ω, VGS = 10V
= 0.165Ω, VGS = 5V
DS(ON)
DS(ON)
DRAIN
(FLANGE)
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
• Simulation Models
®
©
- Temperature Compensated PSPICE and SABER
Electrical Models
GATE
SOURCE
©
- Spice and SABER Thermal Impedance Models
- www.Intersil.com
HUF76609D3S
HUF76609D3
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Switching Time vs R
GS
Curves
Symbol
D
Ordering Information
PART NUMBER
HUF76609D3
PACKAGE
BRAND
76609D
76609D
G
TO-251AA
TO-252AA
HUF76609D3S
S
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUF76609D3ST.
o
Absolute Maximum Ratings
T = 25 C, Unless Otherwise Specified
C
HUF76609D3,
HUF76609D3S
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
100
100
16
V
V
V
DSS
Drain to Gate Voltage (R
GS
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
o
Continuous (T = 25 C, V
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
10
10
7
7
A
A
A
A
C
GS
D
D
o
Continuous (T = 25 C, V
C
GS
o
Continuous (T = 100 C, V
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
GS
D
o
Continuous (T = 100 C, V
C
GS
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
Figure 4
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS
Figures 6, 17, 18
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
49
0.327
W
W/ C
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 175
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
NOTE:
1. T = 25 C to 150 C.
o
o
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
1
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SABER© is a Copyright of Analogy Inc.http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999