Datasheet > HT74173

HT74173

更新时间： 2024-03-03 10:09:34

品牌	Logo	应用领域
台湾合泰/盛群 - HOLTEK		/
页数	文件大小	规格书
20页	2077K
描述
6.0V, 3.0A, 1.2MHz Synchronous Step-Down Converter

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HT74173 数据手册

HT74173

For maximum operating rating conditions, the

maximum junction temperature is 150^oC. However, it’s

recommended that the maximum junction temperature

does not exceed 125^oC in normal operation to keep

high reliability. The derating curve of maximum power

dissipation is as follows:

1.0

8SOP-EP

0.8

0.6

SOT89-5

0.5

0.45

SOT23-5

0.2

75 85 100

125

Ambient Temperature (^oC)

SOT89-5 PCB Layout Example

Thermal Considerations

The maximum power dissipation depends on the

thermal resistance of the IC package, the PCB

layout, the rate of the surrounding airflow and the

allowed diﬀerence between the junction and ambient

temperatures. The maximum power dissipation can be

calculated by the following formula:

P_D(MAX)=(T_J(MAX)–Ta)/θ_JA(W)

Where T_J(MAX)is the maximum junction temperature,

Ta is the ambient temperature and θ_JAis the junction

to ambient thermal resistance of IC package (125^oC/W

for 8-pin SOP-EP).

Rev. 1.00

August 26, 2023

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