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HSMP-3860-BLKG PDF预览

HSMP-3860-BLKG

更新时间: 2024-11-26 02:54:15
品牌 Logo 应用领域
安华高科 - AVAGO 衰减器开关测试光电二极管
页数 文件大小 规格书
10页 273K
描述
Unique Configurations in Surface Mount Packages

HSMP-3860-BLKG 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5其他特性:LOW DISTORTION
应用:ATTENUATOR; SWITCHING最小击穿电压:50 V
配置:SINGLE标称二极管电容:0.2 pF
二极管元件材料:SILICON最大二极管正向电阻:22 Ω
二极管电阻测试电流:1 mA二极管电阻测试频率:100 MHz
二极管类型:PIN DIODEJESD-30 代码:R-PDSO-G3
JESD-609代码:e4少数载流子标称寿命:0.5 µs
湿度敏感等级:1元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
最大功率耗散:0.25 W认证状态:Not Qualified
反向测试电压:50 V子类别:PIN Diodes
表面贴装:YES技术:POSITIVE-INTRINSIC-NEGATIVE
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

HSMP-3860-BLKG 数据手册

 浏览型号HSMP-3860-BLKG的Datasheet PDF文件第2页浏览型号HSMP-3860-BLKG的Datasheet PDF文件第3页浏览型号HSMP-3860-BLKG的Datasheet PDF文件第4页浏览型号HSMP-3860-BLKG的Datasheet PDF文件第5页浏览型号HSMP-3860-BLKG的Datasheet PDF文件第6页浏览型号HSMP-3860-BLKG的Datasheet PDF文件第7页 
HSMP-386x  
Surface Mount PIN Diodes  
Data Sheet  
Description/Applications  
Features  
The HSMP-386x series of general purpose PIN diodes are Unique Configurations in Surface Mount Packages  
designed for two classes of applications. The first is attenu-  
ators where current consumption is the most important  
design consideration. The second application for this  
series of diodes is in switches where low capacitance is the  
driving issue for the designer.  
– Add Flexibility  
– Save Board Space  
– Reduce Cost  
Switching  
– Low Distortion Switching  
– Low Capacitance  
The HSMP-386x series Total Capacitance (CT) and Total  
Resistance (RT) are typical specifications. For applications  
that require guaranteed performance, the general purpose  
HSMP-383x series is recommended.  
Attenuating  
Low Current Attenuating for Less Power  
Consumption  
Matched Diodes for Consistent Performance  
A SPICE model is not available for PIN diodes as SPICE  
does not provide for a key PIN diode characteristic, carrier  
lifetime.  
Better Thermal Conductivity for Higher Power  
Dissipation  
Low Failure in Time (FIT) Rate[1]  
Pin Connections and Package Marking, SOT-363  
Lead-free  
Note:  
1
2
3
6
5
4
1. For more information see the Surface Mount PIN Reliability Data  
Sheet.  
Notes:  
1. Package marking provides orientation, identification, and date code.  
2. See “Electrical Specificationsfor appropriate package marking.  

HSMP-3860-BLKG 替代型号

型号 品牌 替代类型 描述 数据表
HSMP-3860-BLKG AGILENT

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