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HSMP-381E-BLK PDF预览

HSMP-381E-BLK

更新时间: 2024-11-21 04:57:59
品牌 Logo 应用领域
安捷伦 - AGILENT 二极管
页数 文件大小 规格书
12页 91K
描述
Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead)

HSMP-381E-BLK 数据手册

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Surface Mount PIN Diodes  
in SOT-323 (SC-70 3-Lead)  
Technical Data  
HSMP-381B/C/E/F  
HSMP-386B/C/E/F  
HSMP-389B/C/E/F  
HSMP-481B, -482B, -489B  
Features  
Package Lead Code  
Identification  
( Top View)  
Description/Applications  
The HSMP-381B/C/E/F series is  
specifically designed for low  
distortion attenuator applications.  
The HSMP-386B/C/E/F series is a  
general purpose PIN diode  
designed for low current attenua-  
tors and low cost switches. The  
HSMP-389B/C/E/F series is  
optimized for switching applica-  
tions where low resistance at low  
current, and low capacitance are  
required.  
• Diodes Optimized for:  
Low Current Switching  
Low Distortion Attenuating  
Ultra-Low Distortion Switching  
Microwave Frequency  
Operation  
SERIES  
SINGLE  
B
C
• Surface Mount SOT-323  
( SC-70) Package  
COMMON  
ANODE  
COMMON  
CATHODE  
Single and Pair Versions  
Tape and Reel Options  
Available  
E
F
DUAL ANODE DUAL CATHODE  
• Low Failure in Time ( FIT)  
Rate*  
The HSMP-48XB series is special  
products featuring ultra low  
* For more information see the  
Surface Mount PIN Reliability  
Data Sheet.  
parasitic inductance in the SOT-  
323 package, specifically designed  
for use at frequencies which are  
much higher than the upper limit  
for conventional SOT-323 PIN  
diodes. The HSMP-481B diode is a  
low distortion attenuating PIN  
designed for operation to 3 GHz.  
The HSMP-482B diode is ideal for  
limiting and low inductance  
482B/489B  
481B  
Absolute Maximum Ratings[1], TC = + 25°C  
Symbol Parameter  
Unit Absolute Maximum  
If  
Forward Current (1 µs Pulse) Amp  
1
Piv  
TJ  
Peak Inverse Voltage  
Junction Temperature  
Storage Temperature  
Thermal Resistance[2]  
V
°C  
Same as VBR  
150  
switching applications up to  
1.5 GHz. The HSMP-489B is  
optimized for low current switch-  
ing applications up to 3 GHz.  
TSTG  
θjc  
°C  
-65 to 150  
300  
°C/W  
Notes:  
1. Operation in excess of any one of these conditions may result in  
permanent damage to the device.  
2. TC = 25°C, where TC is defined to be the temperature at the package  
pins where contact is made to the circuit board.  

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SILICON, PIN DIODE, SOT-323, 3 PIN