HSEC8-1XXX-XX-XX-DV-X-XX
REVISION AL
DESIGNED & DIMENSIONED
IN MILLIMETERS
OPTION
No OF POSITIONS
-K: POLYIMIDE FILM PAD(SEE FIG 3)
(SEE TABLE 6)
**-09, -10, -20, & -30 (SEE FIG 1)
**-13, ** -25, ** -37, -40, **-49,
-50, & -60 (SEE FIG 2)
(INCHES FOR REFERENCE ONLY)
-TR: TAPE & REEL
DO NOT
SCALE FROM
THIS PRINT
(-09 THRU -70 POS ONLY)
(No OF POS x 0.800 [.0315]) + 4.60 [.181] REF
(LEAVE BLANK FOR TRAY)
**-70, **-80, **-90 & **-100 (PER ROW)
**-L: LATCHING OPTION.
(No OF POS x 0.800 [.0315]) + 1.40[.055] REF
NOT AVAILABLE FOR -GR TYPE USE
(USE HSEC8-XX-01-DV-A-L)
(AVAILABLE IN **-13, **-25, **-37 & **-49
POS ONLY) (SEE SHEET 3, FIG 4)
*,**-L2: ECDP LATCHING OPTION.
NOT AVAILABLE FOR -GR
C
CARD THICKNESS
(SEE NOTES 6, & 7)
AL
2.70 .106
REF
(No OF POS -1 ) x 0.800 [.0315]
C
PLATING SPECIFICATION
USE (USE HSEC8-XX-01-DV-A-L2)
(AVAILABLE IN *,**-09, *,**-13, *,**-25 & *,**-49
POS ONLY) (SEE SHEET 7, FIG 9)
**-BL: BOARD LOCK OPTION.
NOT AVAILABLE FOR -GR TYPE USE
(USE HSEC8-XXX-01-DV-XX-BL)
(SEE SHEET 4, FIG 5)
0.800±0.05 .0315±.002
60
-SM: 30µ" SELECTIVE GOLD IN CONTACT
02
(TOL NON ACCUM)
AREA, MATTE TIN ON TAIL
"A"
-H: 30µ" HEAVY GOLD IN CONTACT
AREA, 3µ" GOLD TAIL)
C
L
-S: 30µ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL
**-GR: GUIDE RAILS
NOT AVAILABLE FOR
-L: 10µ" LIGHT SELECTIVE GOLD IN
"P" REF
"Q" REF "T" REF
CONTACT AREA, MATTE TIN ON TAIL
-L; -BL TYPE USE (SEE SHEET 5, FIG 6)
(USE HSEC8-XXX-01-DV-XX-GR)
(PACKAGING -TR ONLY)
ROW SPECIFICATION
**-PE: PASS THROUGH
(AVAILABLE IN -10, -13 & -20 POS ONLY)
(ONLY AVAILABLE WITH -A OPTION)
(SEE SHEET 6, FIG 7)
"V" 0.10
"W" REF
C
01
59
"A"
C
L
C-188-XX-XX
POSITION #1
INDICATOR
SEE TABLE 5
-WT: WELD TABS (-A OPTION REQUIRED)
(SEE SHEET 6, FIG 8)
OPTION
-A: ALIGNMENT PINS
3.03 .119
REF
2.92 .115
REF
(USE HSEC8X-XXX-XX-DV-A)
(LEAVE BLANK FOR NO -A &
7.80 .307
7.98±0.15 .314±.006
USE HSEC8X-XXX-XX-DV-LC)
AL
REF
(TYP)
C
C
** = AVAILABLE ONLY WITH
-01 CARD THICKNESS
SEE TABLE 1
* = NOT RELEASED
FOR PRODUCTION
2.03 .080 REF
"Y" 0.20
3.60 .142
REF
1.32 .052 REF
(2 PLCS)
C
L
(No OF POS x 0.800[.0315]) + 2.200[.0866] REF
1.12 .044 REF (TYP)
C
SECTION "A"-"A"
1.50 .059
REF
C
L
AL
C
0.80±0.05 .0315±.002
(TOL NON ACCUM)
C
NOTES:
AL
((No OF POS -1 ) x 0.800 [.0315]) 0.08[.003]
C
1.
REPRESENTS A CRITICAL DIMENSION.
FIG 1
2. BURR ALLOWANCE: 0.04[.0015] MAX.
3. MINIMUM PUSHOUT FORCE: 2.2 NEWTONS.
4. ALL TAIL TO TAIL DIMENSIONS MEASURED TIP TO TIP.
5. ASSEMBLIES TO BE PACKAGED IN TRAYS.
6. CARD THICKNESS OPTION
FOR POSITIONS -10, -20 & -30
* = NOT RELEASED FOR PRODUCTION
(SHOWN: HSEC8-130-01-XX-D-DV-A)
F:\DWG\MISC\MKTG\HSEC8-1XXX-XX-XX-DV-X-XX-MKT.SLDDRW
UNLESS OTHERWISE SPECIFIED,
PROPRIETARY NOTE
DIMENSIONS ARE IN MILLIMETERS.
TOLERANCES ARE:
-01:1.57mm[.062] THICK CARD-SEE TABLE 5.
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
-02: 2.00mm[.079] THICK CARD-USE HSEC8A-XXX-02-DV-XX
FOR POSITIONS 10, 20, 30, 40, 50 AND 60 ONLY.
-03: 2.36mm[.093] THICK CARD-USE HSEC8A-XXX-03-DV-XX
FOR POSITIONS 10, 20, 30, 40, 50 AND 60 ONLY.
*-04: 3.18mm[.125] THICK CARD-USE HSEC8A-XXX-04-DV-XX
FOR POSITIONS 10, 20, 30, 40, 50 AND 60 ONLY.
7. MATING EDGE CARD THICKNESS TOLERANCE TO BE ±10% OF NOMINAL.
8. NOTE DELETED.
DECIMALS
ANGLES
.X: .3 [.01]
.XX: .13 [.005]
.XXX: .051 [.0020]
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
code: 55322
e-Mail: info@SAMTEC.com
SHEET SCALE: 2.5:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
0.8mm HIGH SPEED EDGE CARD ASSEMBLY
DWG. HSEC8-1XXX-XX-XX-DV-X-XX
INSULATOR: LCP,
COLOR: -01 CARD THICKNESS BLACK,
NO.
9. NOTE DELETED.
-02 THU -04 CARD THICKNESS NATURAL
CONTACT: BeCu
10. MATING CARD MUST HAVE LEAD-IN. SEE SAMTEC FOOTPRINT FOR SPECIFICATIONS.
BY:
BRATCHER 01/24/03
SHEET 1 OF 7