HSEC8-1XXX-XX-XX-DV-X-XX
REVISION BW
DESIGNED & DIMENSIONED
IN MILLIMETERS
No OF POSITIONS (PER ROW)
OPTION 2
**-PE: PASS THROUGH (SHT 7, FIG 7)
(10, 13, & 20 POS ONLY)
-10, -20, -30 (SEE FIG 1)
■-09, -13, -25, -37, -49, -40, -50, -60, -70,
-80, -90, -100 (SEE FIG 2, SHT 2)
(INCHES FOR REFERENCE ONLY)
DO NOT
SCALE FROM
THIS PRINT
(-A OPTION ONLY)
(NOT AVAILABLE WITH ANY OTHER OPTION
2, EXCEPT -K AND/OR -TR & -FR)
**-BL: BOARD LOCK (SHT 5, FIG 5) (SEE NOTE 11)
(-A OPTION ONLY)
(No OF POS x 0.800 [.0315]) + 4.600 [.1811] 1.126
(No OF POS x 0.800 [.0315]) + 1.400[.0551] REF
CARD THICKNESS
(SEE TABLE 9, SHT 3)
-01: 1.57 [.062] CARD
**-GR: GUIDE RAILS (SHT 6, FIG 6)
(10-60 POS, MULTIPLES OF 10 ONLY)
(SEE NOTE 11)(-TR & -FR PACKAGING ONLY)
-WT: WELD TAB (SHT 7, FIG 8)
(-A OPTION ONLY)
-03: 2.36 [.093] CARD
C
(10-100 POS, MULTIPLES OF 10 ONLY)
(-K & -TR ONLY FOR OPTION 2)
(USE RHSEC8-XXX-03-DV-XX)
(SEE NOTE 7 & 10)
(No OF POS -1 ) x 0.800 [.0315]±0.100
2.70 .106
REF
C
**-L: LATCHING (SHT 4, FIG 4)
(13, 25, 37, & 49 POS ONLY) (SEE NOTE 11)
(-A OPTION ONLY)
60
02
0.800±0.100 .0315±.0039
"A"
(TOL NON ACCUM)
**-L2: ECDP LATCHING (SHT 8, FIG 9)
(09, 13, 25, & 49 POS ONLY) (SEE NOTE 11)
(-A OPTION ONLY)
C
L
PLATING SPECIFICATION
-SM: 30µ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL
-K: POLYIMIDE FILM PAD (SEE SHT 2, FIG 3)
-TR: TAPE & REEL (SEE NOTE 16)
(09 THRU 70 POS ONLY)
-H: 30µ" HEAVY GOLD IN CONTACT
P" REF
"Q" REF "T"' REF
AREA, 3µ" GOLD TAIL)
-FR: FULL REEL QTY. TAPE & REEL (SEE NOTE 15)
(09 THRU 70 POS ONLY)
-S: 30µ" SELECTIVE GOLD IN CONTACT
AREA, MATTE TIN ON TAIL
(LEAVE BLANK FOR TRAY)
-L: 10µ" LIGHT SELECTIVE GOLD IN
CONTACT AREA, MATTE TIN ON TAIL
"A"
OPTION 1
01
59
XHSEC8X-XXX-XX-DV-XX
ROW SPECIFICATION
-DV: DOUBLE VERTICAL
(LEAVE BLANK FOR NO ALIGNMENT PIN,
USE XHSEC8-XXX-01-DV-LC, NOT
AVAILABLE FOR CARD THICKNESS -02 & -03
SEE FIG 10, SHT 3)
POSITION #1
INDICATOR
C
L
-A: ALIGNMENT PIN
(USE XHSEC8X-XXX-XX-DV-A)
** = AVAILABLE ONLY WITH -01 CARD THICKNESS
7.80 .307
REF
■ = AVAILABLE ONLY WITH END OPTIONS -BL, -WT, & -L2
1.32 .052 REF
(2 PLCS)
(SOME FEATURES NOT
SHOWN FOR CLARITY)
SEE NOTE 12
C
+0.09
-0.26
+.004
"V"
-.010
"V"
1.12 .044 REF (TYP)
C-188-XX-XX
3.60 .142
REF
"W" REF
(No OF POS x 0.800[.0315]) + 2.200[.0866] REF
1.50 .059
REF
2.92 .115
REF
C
C
3.03 .119
REF
7.98±0.15 .314±.006 (TYP)
L
SEE TABLE 1
C
C
C
L
0.800±0.100 .0315±.0039
"Y"±0.20 "Y"±.008
(TOL NON ACCUM)
C
NOTES:
SECTION "A"-"A"
FIG 1
((No OF POS -1 ) x 0.800 [.0315])±0.08
FOR POSITIONS -10, -20 & -30
C
1.
REPRESENTS A CRITICAL DIMENSION.
HSEC8-130-01-XX-DV-A SHOWN
2. BURR ALLOWANCE: 0.04[.0015] MAX.
(SOME FEATURES NOT SHOWN FOR CLARITY)
(SEE NOTE 12)
3. MINIMUM PUSHOUT FORCE: 2.2 NEWTONS.
4. ALL TAIL TO TAIL DIMENSIONS MEASURED TIP TO TIP.
5. ASSEMBLIES TO BE PACKAGED IN TRAYS, UNLESS -TR IS SPECIFIED.
6. NOTE DELETED.
7. MATING EDGE CARD THICKNESS TOLERANCE TO BE ±0.15 [.006] OF NOMINAL.
8. NOTE DELETED.
F:\DWG\MISC\MKTG\HSEC8-1XXX-XX-XX-DV-X-XX-MKT.SLDDRW
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN MILLIMETERS.
*
*
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
TOLERANCES ARE:
DECIMALS
9. NOTE DELETED.
ANGLES
2
10. MATING CARD MUST HAVE LEAD-IN. SEE SAMTEC FOOTPRINT FOR SPECIFICATIONS.
11. L, L2, & BL IS NOT APPLICABLE FOR GUIDE RAIL TYPE USE. GR NOT APPLICABLE FOR L,
L2, OR BL TYPE USE.
.X: .3 [.01]
.XX: .13 [.005]
.XXX: .051 [.0020]
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733 FAX: 812-948-5047
e-Mail: info@SAMTEC.com code: 55322
12. CORNER VOIDS AT VENDOR DISCRETION, AND MAY OR MAY NOT BE PRESENT.
13. MEASURE DIMENSION WITH LATCH IN LOCKED, PERPENDICULAR POSITION.
14. VOID WIDTH, LOCATION, AND FREQUENCY TO BE AT VENDORS DISCRETION.
15. -FR OPTIONS WILL BE SHIPPED AT THE MAX QUANTITY PER REEL,
BASED ON OPTIONS SELECTED.
SHEET SCALE: 2.5:1
MATERIAL:
DO NOT SCALE DRAWING
DESCRIPTION:
0.8mm HIGH SPEED EDGE CARD ASSEMBLY
INSULATOR: LCP,
COLOR: -01 CARD THICKNESS BLACK,
-02 & -03 CARD THICKNESS NATURAL
CONTACT: BeCu
DWG. NO.
HSEC8-1XXX-XX-XX-DV-X-XX
16. -TR OPTION ORDERS INVOLVING PARTIAL REEL QUANTITIES MAY BE PACKAGED ACCORDING TO
THE SAMTEC PACKAGING EFFICIENCY STANDARDS (SPES) FOUND ON WWW.SAMTEC.COM
SHEET 1 OF 8
BY:
BRATCHER 01/24/03
5秒后页面跳转
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
