Datasheet > HP3-T03-33B

HP3-T03-33B

更新时间： 2024-12-01 03:42:31

品牌	Logo	应用领域
西迪斯 - CTS		半导体
页数	文件大小	规格书
6页	431K
描述
METAL CASE, CASE-MOUNTED SEMICONDUCTORS

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HP3-T03-33B 数据手册

Series HP3

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

HP3 Series for Single TO-3 or Stud Mount

DESCRIPTION OF CURVES

N.C. Horiz. Device Only

Mounted to G-10.

N.C Horiz. & Vert. With

Dissipator.

200 FPM w/Diss.

500 FPM w/Diss.

1000 FPM w/Diss.

•

Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.

Derate 1.0 °C/watt for unplated part in natural convection only.

Ordering Information

CTS IERC PART NO.

Semiconductor

Accommodated

Hole patt. ref.

no.

Max. Weight

(Grams)

Unplated

HP3-000-U

HP3-T03-U

HP3-T03-33U

Comm'l. Black

Anodize

Mil. Black Anodize

HP3-000-CB

HP3-T03-CB

HP3-T03-33CB

HP3-000-B

HP3-T03-B

HP3-T03-33B

Undrilled

T0-3

T0-3 IC

55.0

12 3 4 5 6

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