Datasheet > HP3-436-U

HP3-436-U

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
西迪斯 - CTS		半导体
页数	文件大小	规格书
6页	431K
描述
METAL CASE, CASE-MOUNTED SEMICONDUCTORS

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

HP3-436-U 数据手册

Series HP3

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

HP3 Series for Single TO-3 or Stud Mount

DESCRIPTION OF CURVES

N.C. Horiz. Device Only

Mounted to G-10.

N.C Horiz. & Vert. With

Dissipator.

200 FPM w/Diss.

500 FPM w/Diss.

1000 FPM w/Diss.

•

Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.

Derate 1.0 °C/watt for unplated part in natural convection only.

Ordering Information

CTS IERC PART NO.

Semiconductor

Accommodated

Hole patt. ref.

no.

Max. Weight

(Grams)

Unplated

HP3-000-U

HP3-T03-U

HP3-T03-33U

Comm'l. Black

Anodize

Mil. Black Anodize

HP3-000-CB

HP3-T03-CB

HP3-T03-33CB

HP3-000-B

HP3-T03-B

HP3-T03-33B

Undrilled

T0-3

T0-3 IC

55.0

12 3 4 5 6

下载PDF

与HP3-436-U相关器件

型号	品牌	描述	获取价格	数据表
HP3-437-B	CTS	METAL CASE, CASE-MOUNTED SEMICONDUCTORS	获取价格
HP3-437-CB	CTS	METAL CASE, CASE-MOUNTED SEMICONDUCTORS	获取价格
HP3-437-U	CTS	METAL CASE, CASE-MOUNTED SEMICONDUCTORS	获取价格
HP350	HAMMOND	DATA SUBJECT TO CHANGE WITHOUT NOTLCE	获取价格
HP-3645	BUD	HAND HELD PLASTIC STYLE 2	获取价格
HP-3646	BUD	HAND HELD PLASTIC STYLE 3	获取价格