生命周期: | Not Recommended | 零件包装代码: | SOIC |
包装说明: | TSSOP, | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.32.00.51 | 风险等级: | 5.61 |
Is Samacsys: | N | 最大时钟频率 (fCLK): | 3 MHz |
JESD-30 代码: | R-PDSO-G8 | 长度: | 4.4 mm |
内存密度: | 65536 bit | 内存集成电路类型: | EEPROM |
内存宽度: | 8 | 功能数量: | 1 |
端子数量: | 8 | 字数: | 8192 words |
字数代码: | 8000 | 工作模式: | SYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
组织: | 8KX8 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 并行/串行: | SERIAL |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
串行总线类型: | SPI | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 1.8 V | 标称供电电压 (Vsup): | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
宽度: | 3 mm | 最长写入周期时间 (tWC): | 8 ms |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
HN58X2564TIE | RENESAS | Serial Peripheral Interface Electrically Erasable and Programmable Read Only Memory |
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HN5-9 | POWER-ONE | Linear Power Supplies Data Sheet |
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HN-591 | MURATA | 900MHz Frequency Hopping Wireless Data Modem |
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HN5-9-OV-A+G | SLPOWER | AC/DC CONVERTER 5V 45W |
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HN611R0+/-2% | VISHAY | Fixed Resistor, Metal Film, 1W, 11ohm, 500V, 2% +/-Tol, 100ppm/Cel, |
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HN61201+/-5% | VISHAY | Fixed Resistor, Metal Film, 1W, 1200ohm, 500V, 5% +/-Tol, 100ppm/Cel, |
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