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HMC737LP4ETR PDF预览

HMC737LP4ETR

更新时间: 2024-01-09 20:43:51
品牌 Logo 应用领域
HITTITE 电信集成电路电信电路输出元件
页数 文件大小 规格书
6页 208K
描述
Telecom Circuit, 1-Func, PQCC24, ROHS COMPLIANT, PLASTIC, QFN-24

HMC737LP4ETR 技术参数

生命周期:Transferred包装说明:HVQCCN,
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.62JESD-30 代码:S-PQCC-N24
长度:4 mm功能数量:1
端子数量:24最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE座面最大高度:1 mm
标称供电电压:4.2 V表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD宽度:4 mm
Base Number Matches:1

HMC737LP4ETR 数据手册

 浏览型号HMC737LP4ETR的Datasheet PDF文件第1页浏览型号HMC737LP4ETR的Datasheet PDF文件第2页浏览型号HMC737LP4ETR的Datasheet PDF文件第3页浏览型号HMC737LP4ETR的Datasheet PDF文件第5页浏览型号HMC737LP4ETR的Datasheet PDF文件第6页 
HMC737LP4 / 737LP4E  
v00.1108  
MMIC VCO w/ HALF FREQUENCY OUTPUT  
14.9 - 15.5 GHz  
Outline Drawing  
NOTES:  
12  
1. LEADFRAME MATERIAL: COPPER ALLOY  
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]  
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.  
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.  
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.  
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.  
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.  
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.  
Application Circuit  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
12 - 229  

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