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HMC659-Die PDF预览

HMC659-Die

更新时间: 2023-12-20 18:46:04
品牌 Logo 应用领域
亚德诺 - ADI 放大器功率放大器
页数 文件大小 规格书
8页 599K
描述
功率放大器芯片,DC - 15 GHz

HMC659-Die 数据手册

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HMC659  
v02.0217  
GaAs PHEMT MMIC  
POWER AMPLIFIER, DC - 15 GHz  
Pad Descriptions  
Pad Number  
Function  
Description  
Interface Schematic  
This pad is DC coupled and matched  
to 50 Ohms. Blocking capacitor is required.  
1
IN  
Gate control 2 for amplifier. Attach bypass  
capacitor per application circuit herein. For nominal  
operation +3V should be applied to Vgg2.  
2
3
Vgg2  
Low frequency termination. Attach bypass  
capacitor per application circuit herein.  
ACG1  
ACG2  
Low frequency termination. Attach bypass  
capacitor per application circuit herein.  
4
RF output for amplifier. Connect DC bias (Vdd) network to  
provide drain current (Idd). See application circuit herein.  
5
7
OUT & Vdd  
ACG3  
Low frequency termination. Attach bypass  
capacitor per application circuit herein.  
Gate control 1 for amplifier. Attach bypass  
capacitor per application circuit herein. Please  
follow “MMIC Amplifier Biasing Procedure”  
application note.  
6
Vgg1  
GND  
Die Bottom  
Die bottom must be connected to RF/DC ground.  
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106  
Phone: 781-329-4700 • Order online at www.analog.com  
6
Application Support: Phone: 1-800-ANALOG-D  

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