HMC584LP5 / 584LP5E
v03.1210
MMIC VCO w/ HALF FREQUENCY OUTPUT
& DIVIDE-BY-4, 12.5 - 13.9 GHz
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
8
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
MSL3 [1]
Package Marking [3]
H584
XXXX
HMC584LP5
Low Stress Injection Molded Plastic
Sn/Pb Solder
H584
XXXX
MSL3 [2]
HMC584LP5E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Pin Descriptions
Pin Number
Function
Description
Interface Schematic
1 - 3, 8 - 10, 13 - 18,
20, 22 - 28, 30 - 32
No Connection. These pins may be connected to RF/
DC ground. Performance will not be affected.
N/C
Divide-by-4 output.
DC block required.
4
6
RFOUT/4
Vcc (Dig)
Supply voltage for prescaler. If prescaler is not
required, this pin may be left open to conserve
approximately 65 mA of current.
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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