HMC520
v01.1007
GaAs MMIC I/Q MIXER
6 - 10 GHz
Harmonics of LO
MxN Spurious Outputs
nLO Spur at RF Port
nLO
LO Freq. (GHz)
1
2
2
3
4
mRF
0
1
2
3
4
5.5
40
44
52
52
46
47
41
48
62
66
59
60
51
45
55
58
69
62
54
69
68
55
47
xx
0
1
2
3
4
xx
31
90
90
90
-6
0
37
47
72
90
90
21
60
69
79
90
61
68
90
90
90
6.5
7.5
69
90
90
8.5
9.5
10.5
RF = 7.6 GHz @ -10 dBm
LO = 7.5 GHz @ +15 dBm
LO = + 15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
Values in dBc below input LO level measured at RF Port.
Absolute Maximum Ratings
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RF / IF Input
+20 dBm
+27 dBm
150°C
LO Drive
Channel Temperature
Die Packaging Information [1]
Continuous Pdiss (T=85°C)
(derate 7.8 mW/°C above 85°C)
508 mW
Standard
Alternate
Thermal Resistance (RTH
(junction to die bottom)
)
128.2 °C/W
GP-2 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
Storage Temperature
Operating Temperature
-65 to +150 °C
-55 to +85 deg °C
Outline Drawing
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
8. OVERALL DIE SIZE .002”
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or apps@hittite.com
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