Datasheet > HMC267QS16G

HMC267QS16G

更新时间： 2024-01-30 18:36:02

品牌	Logo	应用领域
HITTITE		射频微波
页数	文件大小	规格书
6页	365K
描述
Modulator, PLASTIC, SMT, 16 PIN

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技术参数
数据手册

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HMC267QS16G 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	风险等级：	5.92
JESD-609代码：	e0	射频/微波设备类型：	MODULATOR
端子面层：	Tin/Lead (Sn/Pb)	Base Number Matches：	1

HMC267QS16G 数据手册

HMC267QS16G

MICROWAVE CORPORATION

HMC267QS16G QPSK MODULATOR 5 - 6 GHz

FEBRUARY 2000

Truth Table

Schematic

Control Input

A (PIN 8)

A(PIN 9)

STATE

REF

180^o

+90^o

-90^o

0^o

RF OUT

(PIN 13)

RF IN

(PIN 4)

Note: 5V differential between 0 and 1

Logic 1 = +5.0V ± 0.5V

Logic 0 = 0.0V ± 0.5V

90^o

Absolute Maximum Ratings

A, A, B, B

±8 Vdc Max

B (PIN 1)

B (PIN 16)

RF_IN, RF_OUT(8V differential) +27 dBm Max

Operating Temperature

Storage Temperature

-40 ^oC to +85^oC

-65^oC to 150^oC

Outline

EXPOSED GROUND SLUG

(CONNECT TO RF GROUND PLANE)

1. MATERIAL:

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 MM PER SIDE

A) PACKAGE BODY - LOW STRESS INJECTION-MOLDED PLASTIC.

B)LEADFRAMEANDSLUGMATERIAL:COPPER ALLOY

2 . PLATING : LEAD - TIN SOLDER PLATE (LEAD AND SLUG)

3. DIMENSIONS ARE IN INCHES (MILLIMETERS).

5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 MM PER SIDE

UNLESS OTHERWISE SPECIFIEDALLTOL.ARE±0.005(±0.13).

12 Elizabeth Drive, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Web Site: www.hittite.com

5-21

1 2 345 6

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