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HL35056-L PDF预览

HL35056-L

更新时间: 2024-11-16 18:47:43
品牌 Logo 应用领域
富士康 - FOXCONN PC连接器
页数 文件大小 规格书
2页 79K
描述
Board Connector, 10 Contact(s), 2 Row(s), Male, Right Angle, 0.1 inch Pitch, Solder Terminal, Locking, Black Insulator, Plug

HL35056-L 技术参数

生命周期:ActiveReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8536.69.40.40
风险等级:5.76其他特性:ROHS COMPLIANT
主体宽度:0.35 inch主体长度:0.801 inch
主体/外壳类型:PLUG连接器类型:BOARD CONNECTOR
联系完成配合:AU触点性别:MALE
触点材料:COPPER ALLOY触点模式:RECTANGULAR
触点样式:SQ PIN-SKT介电耐压:1400VAC V
绝缘电阻:1000000000 Ω绝缘体颜色:BLACK
插接触点节距:0.1 inch匹配触点行间距:0.1 inch
安装选项1:LOCKING安装方式:RIGHT ANGLE
安装类型:BOARD连接器数:ONE
PCB行数:2装载的行数:2
最高工作温度:105 °C最低工作温度:-55 °C
PCB接触模式:RECTANGULARPCB触点行间距:2.54 mm
电镀厚度:10u inch极化密钥:POLARIZED HOUSING
额定电流(信号):3 A参考标准:UL
可靠性:COMMERCIAL子类别:Headers and Edge Type Connectors
端子长度:0.09 inch端子节距:2.54 mm
端接类型:SOLDER触点总数:10
Base Number Matches:1

HL35056-L 数据手册

 浏览型号HL35056-L的Datasheet PDF文件第2页 
SPECIFICATIONS  
SHROUDED Connector  
HL35 Series  
R/A, T/H Type  
Plug  
Mechanical  
Contact Retention Force: 1.36kg min.  
2.54mmX2.54mm  
[.100] X [.100] Pitch  
Electrical  
Current Rating: 3A Per Pin Min.  
Dielectric Withstanding Voltage: 1000V RMS  
Insulation Resistance: 1000MW min.  
Physical  
Housing: High temperature, UL 94V-0 Color Black  
Contact: Copper Alloy  
Plating: See “ORDERING INFORMATION”  
Operating Temperature: -55to +105℃  
DRAWING  
ORDERING INFORMATION  
PRODUCT NO.: H L 3 5 * * * - * * * *  
Header  
See Drawing No.307-0000-297  
NONE: DIM. D=2.79mm  
L: DIM. D=2.29mm  
See The Attachment 1  
Shrouded Header  
Termination&Contact Type  
Contact Area Plating  
1= Gold Flish  
3=30u" Gold  
No. Of Pos  
05 = 05 Pos  
....  
6=10u" Gold  
7=15u" Gold  
....  
25 = 25 Pos  
F=Gold Flish With Lead Free RoHS COMPLIANCE  
v=15u" Min Gold With Lead Free RoHS COMPLIANCE  
E=Tin Plated With Lead Free RoHS COMPLIANCE  
H=30 u" Min Gold With Lead Free RoHS COMPLIANCE  
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.  

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