5秒后页面跳转
HH80552RE093512/SL96N PDF预览

HH80552RE093512/SL96N

更新时间: 2024-01-04 01:06:22
品牌 Logo 应用领域
英特尔 - INTEL 外围集成电路
页数 文件大小 规格书
95页 2064K
描述
RISC Microprocessor, 32-Bit, 3330MHz, CMOS, PBGA775

HH80552RE093512/SL96N 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LGA, LGA775,30X33,46/43Reach Compliance Code:unknown
风险等级:5.84位大小:32
JESD-30 代码:R-PBGA-N775端子数量:775
封装主体材料:PLASTIC/EPOXY封装代码:LGA
封装等效代码:LGA775,30X33,46/43封装形状:RECTANGULAR
封装形式:GRID ARRAY电源:1.2 V
认证状态:Not Qualified速度:3330 MHz
子类别:Microprocessors标称供电电压:1.2 V
表面贴装:YES技术:CMOS
端子形式:NO LEAD端子节距:1.1 mm
端子位置:BOTTOMuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

HH80552RE093512/SL96N 数据手册

 浏览型号HH80552RE093512/SL96N的Datasheet PDF文件第3页浏览型号HH80552RE093512/SL96N的Datasheet PDF文件第4页浏览型号HH80552RE093512/SL96N的Datasheet PDF文件第5页浏览型号HH80552RE093512/SL96N的Datasheet PDF文件第7页浏览型号HH80552RE093512/SL96N的Datasheet PDF文件第8页浏览型号HH80552RE093512/SL96N的Datasheet PDF文件第9页 
Tables  
1
2
3
4
5
References ..............................................................................................................11  
Voltage Identification Definition..................................................................................15  
Absolute Maximum and Minimum Ratings ....................................................................17  
Voltage and Current Specifications..............................................................................18  
VCC Static and Transient Tolerance for 775_VR_CONFIG_05A and 775_VR_CONFIG_06  
Processors20  
6
7
8
9
Vcc Overshoot Specifications......................................................................................21  
FSB Signal Groups....................................................................................................23  
Signal Characteristics................................................................................................24  
Signal Reference Voltages .........................................................................................24  
10 GTL+ Signal Group DC Specifications ..........................................................................25  
11 GTL+ Asynchronous Signal Group DC Specifications......................................................26  
12 PWRGOOD and TAP Signal Group DC Specifications.......................................................26  
13 VTTPWRGD DC Specifications.....................................................................................27  
14 BSEL[2:0] and VID[5:0] DC Specifications...................................................................27  
15 BOOTSELECT DC Specifications ..................................................................................27  
16 GTL+ Bus Voltage Definitions.....................................................................................28  
17 Core Frequency to FSB Multiplier Configuration.............................................................29  
18 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................30  
19 Front Side Bus Differential BCLK Specifications.............................................................32  
20 Processor Loading Specifications.................................................................................37  
21 Package Handling Guidelines......................................................................................37  
22 Processor Materials...................................................................................................38  
23 Alphabetical Land Assignments...................................................................................44  
24 Numerical Land Assignment.......................................................................................54  
25 Signal Description (Sheet 1 of 9)................................................................................64  
26 Processor Thermal Specifications for 775_VR_CONFIG_05A Processors............................76  
27 Processor Thermal Specifications for 775_VR_CONFIG_06 Processors..............................76  
28 Thermal Profile for 775_VR_CONFIG_05A Processors.....................................................77  
29 Thermal Profile for 775_VR_CONFIG_06 Processors ......................................................78  
30 Thermal “Diode” Parameters using Diode Model............................................................82  
31 Thermal “Diode” Parameters using Transistor Model......................................................82  
32 Thermal “Diode” ntrim and Diode_Correction_Offset.......................................................83  
33 Thermal Diode Interface............................................................................................83  
34 Power-On Configuration Option Signals .......................................................................85  
35 Fan Heatsink Power and Signal Specifications...............................................................92  
6
Datasheet  

与HH80552RE093512/SL96N相关器件

型号 品牌 描述 获取价格 数据表
HH80552RE093512/SL9KL INTEL RISC Microprocessor, 32-Bit, 3330MHz, CMOS, PBGA775

获取价格

HH80552RE099512 INTEL Microprocessor, 32-Bit, 3460MHz, CMOS, CBGA775, LGA-775

获取价格

HH80552RE104512 INTEL RISC Microprocessor, 32-Bit, 3600MHz, CMOS, PBGA775

获取价格

HH80552RE104512/SL9KJ INTEL RISC Microprocessor, 32-Bit, 3600MHz, CMOS, PBGA775

获取价格

HH80553PG0724M/SL94S INTEL RISC Microprocessor, 32-Bit, 2800MHz, CMOS, PBGA775

获取价格

HH80553PG0724MN INTEL Microprocessor, 32-Bit, 2800MHz, CMOS, PBGA775, FLIP CHIP, LGA-775

获取价格