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HH80552PG0882M/SL94X PDF预览

HH80552PG0882M/SL94X

更新时间: 2023-02-26 15:39:58
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
108页 3283K
描述
RISC Microprocessor, 32-Bit, 3200MHz, CMOS, PBGA775

HH80552PG0882M/SL94X 数据手册

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Contents  
Tables  
1-1 References .................................................................................................................................15  
2-1 Voltage Identification Definition ..................................................................................................19  
2-2 Absolute Maximum and Minimum Ratings .................................................................................21  
2-3 Voltage and Current Specification..............................................................................................22  
2-4 V Static and Transient Tolerance for 775_VR_CONFIG_05A Processors.............................24  
CC  
2-5 V Overshoot Specifications ....................................................................................................26  
CC  
2-6 FSB Signal Groups.....................................................................................................................28  
2-7 Signal Characteristics.................................................................................................................29  
2-8 Signal Reference Voltages.........................................................................................................29  
2-9 GTL+ Signal Group DC Specifications .......................................................................................30  
2-10GTL+ Asynchronous Signal Group DC Specifications ...............................................................30  
2-11PWRGOOD and TAP Signal Group DC Specifications..............................................................31  
2-12VTTPWRGD DC Specifications..................................................................................................31  
2-13BSEL[2:0] and VID[5:0] DC Specifications.................................................................................32  
2-14BOOTSELECT DC Specifications..............................................................................................32  
2-15GTL+ Bus Voltage Definitions ....................................................................................................33  
2-16Core Frequency to FSB Multiplier Configuration........................................................................34  
2-17BSEL[2:0] Frequency Table for BCLK[1:0].................................................................................35  
2-18Front Side Bus Differential BCLK Specifications........................................................................37  
3-1 Processor Loading Specifications ..............................................................................................43  
3-2 Package Handling Guidelines ....................................................................................................43  
3-3 Processor Materials....................................................................................................................44  
4-1 Alphabetical Land Assignments .................................................................................................50  
4-2 Numerical Land Assignment.......................................................................................................60  
4-3 Signal Description (Sheet 1 of 9)................................................................................................70  
5-1 Processor Thermal Specifications..............................................................................................80  
5-2 Thermal Profile for Processors with PRB = 0 .............................................................................81  
5-3 Thermal “Diode” Parameters using Diode Model .......................................................................86  
5-4 Thermal “Diode” Parameters using Transistor Model.................................................................86  
5-5 Thermal “Diode” n  
and Diode_Correction_Offset ..................................................................87  
trim  
5-6 Thermal Diode Interface.............................................................................................................87  
6-1 Power-On Configuration Option Signals.....................................................................................89  
7-1 Fan Heatsink Power and Signal Specifications..........................................................................96  
8-1 TMA Power and Signal Specifications......................................................................................104  
8-2 TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors ................107  
§
6
Datasheet  

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