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HH18N1R0B500CG PDF预览

HH18N1R0B500CG

更新时间: 2024-01-18 00:00:16
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
11页 3409K
描述
High Q and low ESR performance at high frequency

HH18N1R0B500CG 数据手册

 浏览型号HH18N1R0B500CG的Datasheet PDF文件第5页浏览型号HH18N1R0B500CG的Datasheet PDF文件第6页浏览型号HH18N1R0B500CG的Datasheet PDF文件第7页浏览型号HH18N1R0B500CG的Datasheet PDF文件第8页浏览型号HH18N1R0B500CG的Datasheet PDF文件第9页浏览型号HH18N1R0B500CG的Datasheet PDF文件第10页 
Multilayer Ceramic Capacitors  
Approval Sheet  
Recommended soldering conditions  
The lead-free termination MLCCs are not only to be used on SMT against lead-free solder paste, but also suitable  
against lead-containing solder paste. If the optimized solder joint is requested, increasing soldering time, temperature and  
concentration of N2 within oven are recommended.  
Fig. 19 Recommended reflow soldering profile for SMT process  
with SnAgCu series solder paste.  
Fig. 20 Recommended wave soldering profile for SMT process  
with SnAgCu series solder.  
Page 11 of 11  
ASC_ HQ_Low ESR_(HH)_006V_AS  
Dec. 2018  

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