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HFBR-5302

更新时间： 2024-01-19 13:53:38
品牌 Logo 应用领域
安捷伦 - AGILENT 光纤
页数 文件大小 规格书
13页 199K
描述
Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package Style

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中文翻译

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HFBR-5302 技术参数

是否Rohs认证： 符合生命周期：Obsolete
Reach Compliance Code：unknownECCN代码：5A991.B.4.A
HTS代码：8517.62.00.50风险等级：5.41
JESD-30 代码：R-XXFO-X功能数量：1
最高工作温度：70 °C最低工作温度：
封装主体材料：UNSPECIFIED封装形状：RECTANGULAR
封装形式：FIBER OPTIC峰值回流温度（摄氏度）：NOT SPECIFIED
认证状态：Not Qualified标称供电电压：5 V
表面贴装：NO电信集成电路类型：TELECOM CIRCUIT
温度等级：COMMERCIAL端子形式：UNSPECIFIED
端子位置：UNSPECIFIED处于峰值回流温度下的最长时间：NOT SPECIFIED

HFBR-5302 数据手册

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Regulatory Compliance  
The first case is during handling  
of the transceiver prior to mount-  
ing it on the circuit board. You  
should use normal ESD handling  
precautions for ESD sensitive  
devices. These precautions  
include using grounded wrist  
straps, work benches, and floor  
mats in ESD controlled areas.  
plane be provided in the circuit  
board directly under the  
transceiver to provide a low  
inductance ground for signal  
return current. This recommen-  
dation is in keeping with good  
high frequency board layout  
practices.  
These transceiver products are  
intended to enable system  
designers to develop equipment  
that complies with the various  
international regulations govern-  
ing certification of Information  
Technology Equipment. See the  
Regulatory Compliance Table for  
details.  
Board Layout - Hole Pattern  
The second case to consider is  
static discharges to the exterior  
of the equipment chassis contain-  
ing the transceiver parts. To the  
extent that the transceiver duplex  
SC connector is exposed to the  
outside of the equipment chassis,  
it may be subject to whatever  
ESD system level test criteria that  
the equipment is intended to  
meet.  
The Hewlett-Packard transceiver  
complies with the circuit board  
“Common Transceiver Footprint”  
hole pattern defined in the  
original multisource announce-  
ment for the 1x9 pin package  
style. This drawing is reproduced  
in Figure 7 with the addition of  
ANSI Y14.5M compliant dimen-  
sioning to be used as a guide in  
the mechanical layout of your  
circuit board.  
Electromagnetic Interference  
(EMI)  
Most equipment designs utilizing  
these high-speed transceivers  
from Hewlett-Packard will need  
to meet the requirements of the  
FCC in the United States,  
CENELEC EN55022 (CISPR 22)  
in Europe and VCCI in Japan.  
The HFBR-5301 and HFBR-5302  
are suitable for use in designs  
ranging from a single transceiver  
in a desktop computer to large  
quantities of transceivers in a  
hub, switch or concentrator.  
Immunity  
Equipment utilizing these trans-  
ceivers will be subject to radio-  
frequency electromagnetic fields  
in some environments. These  
transceivers have a high immunity  
to such fields (see AN1075,  
“Testing and Measuring Electro-  
magnetic Compatibility Perfor-  
mance of the HFBR-510X/520X  
Fiber-Optic Transceivers,” 5963-  
3358E).  
Board Layout – Art Work  
The Applications Engineering  
group has developed Gerber file  
art work for a multilayer printed  
circuit board layout incorporating  
the recommendations above.  
Contact your local Hewlett-  
Packard sales representative for  
details.  
Electrostatic Discharge (ESD)  
There are two design cases in  
which immunity to ESD damage  
is important.  
1.9 ± 0.1  
.075 ± .004  
ø
(2X)  
–A–  
Transceiver Reliability and  
Performance Qualification  
Data  
20.32  
.800  
Ø0.000  
M
A
The 1x9 transceivers have passed  
Hewlett-Packard reliability and  
performance qualification testing  
and are undergoing ongoing  
quality monitoring. Details are  
available from your Hewlett-  
Packard sales representative.  
0.8 ± 0.1  
.032 ± .004  
ø
(9X)  
20.32  
.800  
Ø0.000  
M
A
These transceivers are manu-  
factured at the Hewlett-Packard  
Singapore location which is an  
ISO 9002 certified facility.  
2.54  
(8X)  
.100  
TOP VIEW  
Figure 7. Recommended Board Layout Hole Pattern.  
219  
12345678...13

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