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HFBR-5302

更新时间： 2024-02-12 11:55:41
品牌 Logo 应用领域
安捷伦 - AGILENT 光纤
页数 文件大小 规格书
13页 199K
描述
Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package Style

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中文翻译

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HFBR-5302 技术参数

是否Rohs认证： 符合生命周期：Obsolete
Reach Compliance Code：unknownECCN代码：5A991.B.4.A
HTS代码：8517.62.00.50风险等级：5.41
JESD-30 代码：R-XXFO-X功能数量：1
最高工作温度：70 °C最低工作温度：
封装主体材料：UNSPECIFIED封装形状：RECTANGULAR
封装形式：FIBER OPTIC峰值回流温度（摄氏度）：NOT SPECIFIED
认证状态：Not Qualified标称供电电压：5 V
表面贴装：NO电信集成电路类型：TELECOM CIRCUIT
温度等级：COMMERCIAL端子形式：UNSPECIFIED
端子位置：UNSPECIFIED处于峰值回流温度下的最长时间：NOT SPECIFIED

HFBR-5302 数据手册

 浏览型号HFBR-5302的Datasheet PDF文件第1页浏览型号HFBR-5302的Datasheet PDF文件第3页浏览型号HFBR-5302的Datasheet PDF文件第4页浏览型号HFBR-5302的Datasheet PDF文件第5页浏览型号HFBR-5302的Datasheet PDF文件第6页浏览型号HFBR-5302的Datasheet PDF文件第7页 
The electrical subassembly con-  
sists of a high volume multilayer  
printed circuit board to which the  
IC chips and various surface-  
mount passive circuit elements  
are attached.  
ELECTRICAL SUBASSEMBLY  
QUANTIZER IC  
DUPLEX SC  
RECEPTACLE  
DATA OUT  
PIN  
SIGNAL  
DETECT  
OUT  
PREAMP IC  
OPTICAL  
SUBASSEMBLIES  
The package includes internal  
shields for the electrical and  
optical subassemblies to insure  
high immunity to external EMI  
fields and low EMI emissions.  
LED  
DATA IN  
DRIVER IC  
TOP VIEW  
Figure 1. Block Diagram.  
The outer housing, including the  
duplex SC connector, is molded  
of filled non-conductive plastic to  
provide mechanical strength and  
electrical isolation. The solder  
posts are isolated from the circuit  
design of the transceiver, while  
they can be connected to a  
The package outline drawing and  
pin out are shown in Figures 2  
and 3. The details of this package  
outline and pin out are compliant  
with the multisource definition of  
the 1x9 single in-line package  
(SIP). The low profile of the  
Hewlett-Packard transceiver  
design complies with the  
maximum height allowed for the  
duplex SC connector over the  
entire length of the package.  
The optical subassemblies utilize  
a high volume assembly process  
together with low cost lens  
elements which result in a cost  
effective building block.  
ground plane on the circuit  
board, doing so will have no  
impact on circuit performance.  
The transceiver is attached to a  
printed circuit board with the  
nine signal pins and the two  
solder posts which exit the  
bottom of the housing. The two  
solder posts provide the primary  
mechanical strength to withstand  
the loads imposed on the trans-  
ceiver by mating with the duplex  
SC connectored fiber cables.  
39.12  
(1.540)  
12.70  
(0.500)  
MAX.  
AREA  
RESERVED  
FOR  
PROCESS  
25.40  
(1.000)  
12.70  
(0.500)  
MAX.  
PLUG  
HFBR-5XXX  
DATE CODE (YYWW)  
H
SINGAPORE  
+ 0.08  
- 0.05  
0.75  
3.30 ± 0.38  
(0.130 ± 0.015)  
+ 0.003  
- 0.002  
10.35  
(0.407)  
(0.030  
)
MAX.  
Application Information  
The Applications Engineering  
group in the Hewlett-Packard  
Optical Communication Division  
is available to assist with the  
technical understanding and  
design trade-offs associated with  
these transceivers. You can  
contact them through your local  
Hewlett-Packard sales  
2.92  
(0.115)  
18.52  
(0.729)  
4.14  
+ 0.25  
- 0.05  
+ 0.010  
- 0.002  
1.27  
0.46  
(0.018)  
)
ø
(9x)  
(0.050  
(0.163)  
NOTE 1  
NOTE 1  
23.55  
(0.927)  
20.32  
(0.800)  
16.70  
(0.657)  
17.32 20.32 23.32  
(0.682) (0.800) (0.918)  
[8x(2.54/.100)]  
0.87  
(0.034)  
23.24  
(0.915)  
15.88  
(0.625)  
representative.  
NOTE 1: THE SOLDER POSTS AND ELECTRICAL PINS ARE PHOSPHOR BRONZE WITH TIN LEAD OVER NICKEL PLATING.  
DIMENSIONS ARE IN MILLIMETERS (INCHES).  
The following information is  
provided to answer some of the  
most common questions about  
the use of these parts.  
Figure 2. Package Outline Drawing.  
216  
1234567...13

中文翻译

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