HFA5253
Semiconductor
October 1998
File Number 4003.4
800MHz, Ultra High-Speed Monolithic Pin
Driver
Features
• High Digital Data Rate . . . . . . . . . . . . . . . . . . . . . 800MHz
• Very Fast Rise/Fall Times. . . . . . . . . . . . . . . . . . . . . 500ps
• Wide Output Range . . . . . . . . . . . . . . . . . . . . . +8V to -3V
• Precise 50Ω Output Impedance
The HFA5253 is a very high speed monolithic pin driver
solution for high performance test systems. The device will
switch at high data rates between two input voltage levels
providing variable amplitude pulses. Slew Rate Control pins
provide independent control over positive and negative slew
rate allowing the customer to optimize the pin driver speed
for their application. The output impedance is trimmed to
achieve a precision 50Ω source for impedance matching.
Two differential ECL/TTL compatible inputs control the
• High Impedance, Three-State Output Control
• Slew Rate Control
Applications
operation of the HFA5253, one controlling the V
/V
HIGH LOW
• IC Tester Pin Electronics
• Pattern Generators
• Pulse Generators
switching and the other controlling the output’s high-
impedance state. The HFA5253’s 800MHz data rate makes it
compatible with today’s high-speed VLSI test systems and
the +8V to -3V output swing satisfies the most stringent
testing requirements of all common logic families.
• Level Comparator/Translator
The HFA5253 is manufactured in Harris’ proprietary
complementary bipolar UHF-1 process.
Part Number Information
TEMP. RANGE
PKG.
NO.
o
PART NUMBER
( C)
PACKAGE
HFA5253CB
0 to 50
20 Ld PSOP
M20.3A
Pinout
Block Diagram
HFA5253 (PSOP)
INPUT BUFFER
TOP VIEW
V
HIGH
+SRC
1
2
V
V
V
V
V
V
20
19
CC1
CC1
CC2
CC2
HIGH
+SRC
Q
Q
V
CC
DATA
DATA
-
3
18 NC
+
50Ω
4
17 DATA
16 DATA
V
OUT
5
OUT
NC
6
15
NC
HIZ
HIZ
+
-
V
14 HIZ
13 HIZ
12
7
EE2
EE2
EE1
EE1
V
V
V
8
V
EE
9
-SRC
-SRC
10
11 V
LOW
V
LOW
INPUT BUFFER
POWER PSOP PACKAGE
(HEAT SLUG SURFACE IS ELECTRICALLY FLOATING)
TRUTH TABLE FOR V
OUT
DATA
0
1
0
1
V
V
LOW
HIGH
HIZ
HIZ
HIZ
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Copyright © Harris Corporation 1998
89