HD Mezz
The HD Mezz performs at 9.0 GHz/pair at a 20mm stack
HD Mezz is a 1.2mm x 2mm
grid interconnect system for
elevated, high speed board-to-
board applications. The high
density array’s open pin field
Elevated stack heights of 20mm,
25mm, 30mm and 35mm
design allows both single-end-
High density elevated
ed or differential pair routing.
When routed differentially, HD
Mezz is rated at 9.0 GHz/pair at
a 20mm stack height. The HD
Mezz is sourced by both Sam-
tec and Molex Incorporated.
board-to-board
143, 195, and 299 positions
The HDAM/HDAF Series
(HD Mezz) is available in:
1.2mm x 2mm grid
• 143, 195, and 299 positions
• 20mm, 25mm, 30mm, and
35mm standard stack heights
• Custom heights available
Dual wipe contacts provide a
reliable mating interface and
the 1.2mm grid is ideal for
applications where PCB real
estate is limited.
Guide posts for alignment
The HD Mezz has the option to
contain lead or a lead-free tin
alloy, to meet RoHS compliancy
requirements. The HDAM/
HDAF Series also incorporates
guide posts as a standard
feature to aid in alignment.
system. This information is
a time saving and unmatch-
ed service in the interconnect
industry. Visit www.finalinch.
com for more information.
Final Inch® information is
available for the HD Mezz
system. Final Inch® is a
“reference design” for one of
the most difficult design issues
on the board - the Breakout
Region (BOR) around the
connector. Samtec can
Other high density, high speed
array interconnects include:
• SEARAY™
• DP Array™
• SamArray®
provide empirical TDR and
frequency domain data, test
boards, and validated elect-
rical models for the HD Mezz
©Samtec, Inc., 2007
*HD Mezz is a trademark of Molex Incorporated.