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HDMEZZ

更新时间: 2024-11-30 12:29:47
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申泰 - SAMTEC /
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描述
The HD Mezz performs at 9.0 GHz/pair at a 20mm stack

HDMEZZ 数据手册

  
HD Mezz  
The HD Mezz performs at 9.0 GHz/pair at a 20mm stack  
HD Mezz is a 1.2mm x 2mm  
grid interconnect system for  
elevated, high speed board-to-  
board applications. The high  
density array’s open pin field  
Elevated stack heights of 20mm,  
25mm, 30mm and 35mm  
design allows both single-end-  
High density elevated  
ed or differential pair routing.  
When routed differentially, HD  
Mezz is rated at 9.0 GHz/pair at  
a 20mm stack height. The HD  
Mezz is sourced by both Sam-  
tec and Molex Incorporated.  
board-to-board  
143, 195, and 299 positions  
The HDAM/HDAF Series  
(HD Mezz) is available in:  
1.2mm x 2mm grid  
• 143, 195, and 299 positions  
• 20mm, 25mm, 30mm, and  
35mm standard stack heights  
• Custom heights available  
Dual wipe contacts provide a  
reliable mating interface and  
the 1.2mm grid is ideal for  
applications where PCB real  
estate is limited.  
Guide posts for alignment  
The HD Mezz has the option to  
contain lead or a lead-free tin  
alloy, to meet RoHS compliancy  
requirements. The HDAM/  
HDAF Series also incorporates  
guide posts as a standard  
feature to aid in alignment.  
system. This information is  
a time saving and unmatch-  
ed service in the interconnect  
industry. Visit www.finalinch.  
com for more information.  
Final Inch® information is  
available for the HD Mezz  
system. Final Inch® is a  
“reference design” for one of  
the most difficult design issues  
on the board - the Breakout  
Region (BOR) around the  
connector. Samtec can  
Other high density, high speed  
array interconnects include:  
SEARAY™  
DP Array™  
SamArray®  
provide empirical TDR and  
frequency domain data, test  
boards, and validated elect-  
rical models for the HD Mezz  
©Samtec, Inc., 2007  
*HD Mezz is a trademark of Molex Incorporated.  

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