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HDD32M72D9RPW PDF预览

HDD32M72D9RPW

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
HANBIT 动态存储器双倍数据速率
页数 文件大小 规格书
10页 407K
描述
DDR SDRAM Module 256Mbyte (32Mx72bit), based on 32Mx8, 4Banks 8K Ref., 184Pin-DIMM with PLL & Register

HDD32M72D9RPW 数据手册

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HANBit  
HDD32M72D9RPW  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
Voltage on any pin relative to Vss  
Voltage on VDD supply relative to Vss  
Voltage on VDDQ supply relative to Vss  
Storage temperature  
SYMBOL  
VIN, VOUT  
VDD  
RATING  
UNTE  
V
-0.5 ~ 3.6  
-1.0 ~ 3.6  
-1.0 ~ 3.6  
-55 ~ +150  
13.5  
V
VDDQ  
TSTG  
V
°C  
W
Power dissipation  
PD  
Short circuit current  
IOS  
50  
mA  
Notes: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.  
Functional operation should be restricted to recommended operating condition.  
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.  
POWER & DC OPERATING CONDITIONS  
(Recommended operating conditions (Voltage referenced to Vss = 0V, TA = 0 to 70°C) )  
PARAMETER  
SYMBOL  
VDD  
MIN  
2.3  
MAX  
2.7  
UNIT  
V
NOTE  
Supply Voltage  
I/O Supply Voltage  
VDDQ  
2.3  
2.7  
V
I/O Reference Voltage  
VREF  
V
1
2
VDDQ/2-50mV  
VREF 0.04  
VREF + 0.15  
-0.3  
VDDQ/2+50mV  
VREF + 0.04  
VREF + 0.3  
VREF - 0.15  
VDDQ + 0.3  
VDDQ + 0.6  
2
I/O Termination Voltage(system)  
Input High Voltage  
VTT  
V
VIH (DC)  
VIL (DC)  
VIN (DC)  
VID (DC)  
I LI  
V
Input Low Voltage  
V
Input Voltage Level, CK and /CK inputs  
Input Differential Voltage, CK and /CK inputs  
Input leakage current  
-0.3  
V
0.3  
V
-2  
uA  
uA  
3
Output leakage current  
I OZ  
-5  
5
Output High current (Normal strengh driver)  
;VOUT = VTT + 0.84V  
I OH  
I OL  
IOH  
IOL  
-16.8  
16.8  
-9  
mA  
mA  
mA  
mA  
Output Low current (Normal strengh driver)  
;VOUT = VTT - 0.84V  
Output High current (Half strengh driver)  
;VOUT = VTT + 0.45V  
Output Low current (Half strengh driver)  
;VOUT = VTT - 0.45V  
9
Notes  
1. Includes ± 25mV margin for DC offset on VREF, and a combined total of ± 50mV margin for all AC noise and DC offset on VREF  
bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on VREF and internal DRAM noise coupled  
TO VREF, both of which may result in VREF noise. VREF should be de-coupled with an inductance of £ 3nH.  
,
2. VTT is not applied directly to the device. V TT is a system supply for signal termination resistors, is expected to be set equal to  
VREF, and must track variations in the DC level of VREF  
3. VID is the magnitude of the difference between the input level on CK and the input level on CK.  
4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in  
simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ.  
5. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the dc level of the same.  
6. These charactericteristics obey the SSTL-2 class II standards.  
URL : www.hbe.co.kr  
REV 1.0 (JUNE.2003)  
5
HANBit Electronics Co.,Ltd.  

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