HANBit
HDD32M72D9RPW
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Voltage on any pin relative to Vss
Voltage on VDD supply relative to Vss
Voltage on VDDQ supply relative to Vss
Storage temperature
SYMBOL
VIN, VOUT
VDD
RATING
UNTE
V
-0.5 ~ 3.6
-1.0 ~ 3.6
-1.0 ~ 3.6
-55 ~ +150
13.5
V
VDDQ
TSTG
V
°C
W
Power dissipation
PD
Short circuit current
IOS
50
mA
Notes: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
POWER & DC OPERATING CONDITIONS
(Recommended operating conditions (Voltage referenced to Vss = 0V, TA = 0 to 70°C) )
PARAMETER
SYMBOL
VDD
MIN
2.3
MAX
2.7
UNIT
V
NOTE
Supply Voltage
I/O Supply Voltage
VDDQ
2.3
2.7
V
I/O Reference Voltage
VREF
V
1
2
VDDQ/2-50mV
VREF – 0.04
VREF + 0.15
-0.3
VDDQ/2+50mV
VREF + 0.04
VREF + 0.3
VREF - 0.15
VDDQ + 0.3
VDDQ + 0.6
2
I/O Termination Voltage(system)
Input High Voltage
VTT
V
VIH (DC)
VIL (DC)
VIN (DC)
VID (DC)
I LI
V
Input Low Voltage
V
Input Voltage Level, CK and /CK inputs
Input Differential Voltage, CK and /CK inputs
Input leakage current
-0.3
V
0.3
V
-2
uA
uA
3
Output leakage current
I OZ
-5
5
Output High current (Normal strengh driver)
;VOUT = VTT + 0.84V
I OH
I OL
IOH
IOL
-16.8
16.8
-9
mA
mA
mA
mA
Output Low current (Normal strengh driver)
;VOUT = VTT - 0.84V
Output High current (Half strengh driver)
;VOUT = VTT + 0.45V
Output Low current (Half strengh driver)
;VOUT = VTT - 0.45V
9
Notes
1. Includes ± 25mV margin for DC offset on VREF, and a combined total of ± 50mV margin for all AC noise and DC offset on VREF
bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on VREF and internal DRAM noise coupled
TO VREF, both of which may result in VREF noise. VREF should be de-coupled with an inductance of £ 3nH.
,
2. VTT is not applied directly to the device. V TT is a system supply for signal termination resistors, is expected to be set equal to
VREF, and must track variations in the DC level of VREF
3. VID is the magnitude of the difference between the input level on CK and the input level on CK.
4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in
simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ.
5. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the dc level of the same.
6. These charactericteristics obey the SSTL-2 class II standards.
URL : www.hbe.co.kr
REV 1.0 (JUNE.2003)
5
HANBit Electronics Co.,Ltd.