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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| HD81910CPS2 | ETC |
获取价格 |
Telecommunication IC |
|
| HD81910FS2 | ETC |
获取价格 |
Telecommunication IC |
|
| HD81910PS2 | ETC |
获取价格 |
Telecommunication IC |
|
| HD81A810 | ETC |
获取价格 |
16-Bit Digital Signal Processor |
|
| HD8202E | FOXCONN |
获取价格 |
Board Connector, 2 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Solder Termi |
|
| HD8202V | FOXCONN |
获取价格 |
Board Connector, 2 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Solder Termi |
|
| HD8203E | FOXCONN |
获取价格 |
Board Connector, 3 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Solder Termi |
|
| HD8203V | FOXCONN |
获取价格 |
Board Connector, 3 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Solder Termi |
|
| HD8204E | FOXCONN |
获取价格 |
Board Connector, 4 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Solder Termi |
|
| HD8204V | FOXCONN |
获取价格 |
Board Connector, 4 Contact(s), 1 Row(s), Male, Right Angle, 0.049 inch Pitch, Solder Termi |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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