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HD6432236BW(XXX)TE PDF预览

HD6432236BW(XXX)TE

更新时间: 2024-11-21 12:58:23
品牌 Logo 应用领域
瑞萨 - RENESAS /
页数 文件大小 规格书
1071页 7054K
描述
16-BIT, MROM, MICROCONTROLLER, PQFP100, 14 X 14 MM, 0.50 MM PITCH, TQFP-100

HD6432236BW(XXX)TE 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Active零件包装代码:QFP
包装说明:TFQFP,针数:100
Reach Compliance Code:unknown风险等级:5.4
Is Samacsys:N具有ADC:YES
地址总线宽度:24位大小:16
DAC 通道:YESDMA 通道:YES
外部数据总线宽度:16JESD-30 代码:S-PQFP-G100
JESD-609代码:e0长度:14 mm
I/O 线路数量:78端子数量:100
最高工作温度:75 °C最低工作温度:-20 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:TFQFP封装形状:SQUARE
封装形式:FLATPACK, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):NOT SPECIFIED
认证状态:Not QualifiedROM可编程性:MROM
座面最大高度:1.2 mm标称供电电压:5 V
表面贴装:YES温度等级:COMMERCIAL EXTENDED
端子面层:TIN LEAD端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

HD6432236BW(XXX)TE 数据手册

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REJ09B0054-0500  
The revision list can be viewed directly by  
clicking the title page.  
The revision list summarizes the locations of  
revisions and additions. Details should always  
be checked by referring to the relevant text.  
H8S/2258, H8S/2239, H8S/2238,  
H8S/2237, H8S/2227Groups  
Hardware Manual  
16  
Renesas 16-Bit Single-Chip Microcomputer  
H8S Family/H8S/2200 Series  
H8S/2258  
HD64F2258  
HD6432258  
HD6432258W  
HD6432256  
HD6432256W  
HD64F2239  
HD6432239  
HD6432239W  
H8S/2236R HD6432236R  
HD6432236RW  
H8S/2237  
HD6472237  
HD6432237  
HD6432235  
HD6432233  
HD64F2227  
HD6432227  
HD6432225  
HD6432224  
HD6432223  
H8S/2256  
H8S/2239  
H8S/2235  
H8S/2233  
H8S/2227  
H8S/2238B HD64F2238B  
HD6432238B  
H8S/2225  
H8S/2224  
H8S/2223  
HD6432238BW  
H8S/2238R HD64F2238R  
HD6432238R  
HD6432238RW  
H8S/2236B HD6432236B  
HD6432236BW  
Rev. 5.00  
Revision Date: Aug 08, 2006  

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