Datasheet > HCS374MS_04

HCS374MS_04

更新时间： 2024-01-24 03:29:37

品牌	Logo	应用领域
英特矽尔 - INTERSIL		触发器
页数	文件大小	规格书
10页	555K
描述
Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered

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中文翻译

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数据手册

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HCS374MS_04 数据手册

HCS374MS

Radiation Hardened Octal D-Type

Flip-Flop, Three-State, Positive Edge Triggered

November 11, 2004

Features

Pinouts

20 LEAD CERAMIC DUAL-IN-LINE

METAL SEAL PACKAGE (SBDIP)

MIL-STD-1835 CDIP2-T20

• 3 Micron Radiation Hardened SOS CMOS

• Total Dose 200K RAD (Si)

• SEP Effective LET No Upsets: >100 MEV-cm²/mg

• Single Event Upset (SEU) Immunity < 2 x 10^-9Errors/Bit-

Day (Typ)

• Dose Rate Survivability: >1 x 10¹²RAD (Si)/s

• Dose Rate Upset >10¹⁰RAD (Si)/s 20ns Pulse

• Latch-Up Free Under Any Conditions

• Fanout (Over Temperature Range)

- Bus Driver Outputs - 15 LSTTL Loads

• Military Temperature Range: -55^oC to +125^oC

• Significant Power Reduction Compared to LSTTL ICs

• DC Operating Voltage Range: 4.5V to 5.5V

• Input Logic Levels

TOP VIEW

VCC

18 D7

17 D6

16 Q6

15 Q5

14 D5

13 D4

GND 10

11 CP

- VIL = 0.3 VCC Max

- VIH = 0.7 VCC Min

• Input Current Levels Ii ≤ 5µA at VOL, VOH

Description

20 LEAD CERAMIC METAL SEAL

FLATPACK PACKAGE (FLATPACK)

MIL-STD-1835 CDFP4-F20

TOP VIEW

The Intersil HCS374MS is a Radiation Hardened non-inverting

octal D-type, positive edge triggered flip-flop with three-stateable

outputs. The HCS374MS utilizes advanced CMOS/SOS technol-

ogy. The eight flip-flops enter data into their registers on the

LOW-to-HIGH transition of the clock (CP). Data is also

transferred to the outputs during this transition. The output

enable (OE) controls the three-state outputs and is independent

of the register operation. When the output enable is high, the out-

puts are in the high impedance state.

VCC

The HCS374MS utilizes advanced CMOS/SOS technology to

achieve high-speed operation. This device is a member of

radiation hardened, high-speed, CMOS/SOS Logic Family.

GND

The HCS374MS is supplied in a 20 lead Ceramic flatpack

(K suffix) or a SBDIP Package (D suffix).

Ordering Information

PART NUMBER

HCS374DMSR

TEMPERATURE RANGE

-55^oC to +125^oC

+25^oC

SCREENING LEVEL

Intersil Class S Equivalent

Sample

PACKAGE

20 Lead SBDIP

HCS374KMSR

20 Lead Ceramic Flatpack

20 Lead SBDIP

HCS374D/Sample

HCS374K/Sample

HCS374HMSR

+25^oC

Sample

20 Lead Ceramic Flatpack

Die

+25^oC

Die

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

Spec Number 518770

File Number 2470.3

12 3 4 5 6 7...10

中文翻译

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